聚碳酸酯及聚碳酸酯合金导热绝缘高分子材料的研究

材料热处理学报, 2007, 28(4): 51-54. doi: 10.3969/j.issn.1009-6264.2007.04.012

聚碳酸酯及聚碳酸酯合金导热绝缘高分子材料的研究

李丽 ^1, , 王成国 ^2, , 李同生 ^3, , 陈文忠 ^4,

1.山东大学材料科学与工程学院,山东,济南,250061;复旦大学高分子科学系,上海,200433

2.山东大学材料科学与工程学院,山东,济南,250061

3.复旦大学高分子科学系,上海,200433

4.复旦大学高分子科学系,上海,200433

关键词：导热系数 , 聚碳酸酯(PC) , 聚碳酸酯合金(PC/ABS) , 填料 , 力学性能

Study on thermal conducting insulating polycarbonate and polycarbonate/ABS polymers

分别以聚碳酸酯(PC)、聚碳酸酯和ABS合金(PC/ABS)为基体,以氧化铝(Al2O3)、碳化硅(SiC)、氧化铋(BiO)等作为导热填料,用挤出机造粒,注塑机成型样条.研究了填料种类、形状、填充量对复合材料的导热性能和力学性能的影响.结果表明,填充30wt%～50wt%氧化铝的PC导热系数从原来的0.2提高到0.528W/mK;30wt% SiC填充PC/ABS的导热系数为1.099 W/mK;30wt% BiO填充PC/ABS的导热系数达1.226W/mK.其中30wt% SiC填充PC/ABS的综合性能最好.填料有一定的长径比,对材料的力学性能和形成导热网链有利.

参考文献

[1]	Wong C.P.;Bollampally S. .Thermal Conductivity,Elastic Modulus,and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging[J].Journal of Applied Polymer Science,1999(14):3396-3403.
[2]	Yunsheng Xu;D. D. L. Chung;Cathleen Mroz .Thermally conducting aluminum nitride polymer-matrix composites[J].Composites, Part A. Applied science and manufacturing,2001(12):1749-1757.
[3]	Lee Geon-Woong;Park Min;Kim Junkyung et al.Enhanced filled with hybrid filler[J].Composites Part A:Applied Science and Manufacturing,2006,37(05):727-734.
[4]	Bernd Weidenfeller;Michael Hofer;Frank Schilling .Thermal and electrical properties of magnetite filled polymers[J].Composites, Part A. Applied science and manufacturing,2002(8):1041-1053.
[5]	石彤非,李树忠,张万喜.填充型导热塑料[J].高分子材料科学与工程,1994(03):8-13.
[6]	厉雷;左逢兴.塑料技术标准手册[M].北京:化学工业出版社,1996:92-1065.
[7]	F. Danes;B. Garnier;T. Dupuis .Predicting, measuring, and tailoring the transverse thermal conductivity of composites from polymer matrix and metal filler[J].International Journal of Thermophysics,2003(3):771-784.
[8]	Bernd Weidenfeller;Michael Hofer;Frank R. Schilling .Thermal conductivity, thermal diffusivity, and specific heat capacity of particle filled polypropylene[J].Composites, Part A. Applied science and manufacturing,2004(4):423-429.
[9]	Luyt AS;Molefi JA;Krump H .Thermal, mechanical and electrical properties of copper powder filled low-density band linear low-density polyethylene composites[J].Polymer Degradation and Stability,2006(7):1629-1636.
[10]	林晓丹,曾幸荣,张金柱,张贞祥,徐迎宾.PPS导热绝缘塑料的制备及性能研究[J].塑料工业,2006(03):65-67.
[11]	Ishida H.;Rimdusit S. .Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine[J].Thermochimica Acta: An International Journal Concerned with the Broader Aspects of Thermochemistry and Its Applications to Chemical Problems,1998(1/2):177-186.

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聚碳酸酯及聚碳酸酯合金导热绝缘高分子材料的研究

Study on thermal conducting insulating polycarbonate and polycarbonate/ABS polymers

参考文献