硅酮压敏胶生产工艺的研究

1.上海工程技术大学化学化工学院,上海,200065

2.上海金张绝缘材料有限公司,上海,200032

3.上海工程技术大学化学化工学院,上海,200065

Study of polyorganosiloxane press-sensitive adhesive producing process

用硅酮压敏胶与不同基材复合制造压敏胶带时,胶层厚度、交联剂的用量对剪切强度和剥离强度有影响,研究结果表明:胶层厚度为0.05～0.06mm,交联剂为硅酮树脂用量的2%～3%,固化条件为80℃,2min,180℃,5min时效果较佳.

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