低温烧结、低介电常数和低介质损耗的陶瓷材料是影响叠层片式电感发展的低介电常数陶瓷材料的最新研究,重点介绍了玻璃-陶瓷复合体系和微晶玻璃体系的材料研究进展,并简述了MLCI低温烧结方法和发展趋势.
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