介绍和评述了双马来酰亚胺(BMI)/烯丙基苯基化合物(APC)/环氧化合物(EP)高性能多元共聚树脂的化学结构与固化反应,以及在耐热电绝缘材料、高性能覆铜板、半导体封装材料和耐热胶粘剂等领域的研究与应用进展情况.
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