综述了近年来国际上低介电常数纳米多孔SiOx薄膜材料的发展状况,重点论述了其后处理原理及工艺、材料结构特点及存在的缺陷,分类指出了后处理方法对材料改性的影响及存在的问题,同时提出了未来的研究方向和发展前景.
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