Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem.On the basis of CALPHAD (Calculation of Phase Diagrams) method we can easily calculate properties such as the liquidus projection, isothermal and vertical sectional diagrams and phase fraction in multicomponent system including Ag, Bi, Cu, In, Sb, Sn, Zn and Pb elements. Inaddition, other related information such as the surface tension, viscosity of the liquid phase and solidification simulation can also be obtained. DICTRA (Diffusion Controlled Transformation) software was used to simulate the interfacial reactions between substrate and Pb-free solders, which can easily give the information on the growth of intermetallic compounds and moving speed of interface between substrate and solders etc.
参考文献
| [1] | Vianco P T;Frear D R .Issues in the replacement of LeadBearing solders[J].Journal of The Minerals,Metals & Materials Society,1993,45:14. |
| [2] | J. Glazer .Metallurgy of low temperature Pb-free solders for electronic assembly[J].International Materials Reviews,1995(2):65-93. |
| [3] | Sundman Bo;Jansson Bo;Anderson T O .The hermo-calc databank system[J].CALPHAD-Computer Coupling of Phase Diagrams and Thermochemistry,1985,9:153-190. |
| [4] | Borgenstam A.;Engstrom A. .DICTRA, a Tool for Simulation of Diffusional Transformations in Alloys[J].Journal of Phase Equilibria,2000(3):269-280. |
| [5] | Hillert M;Staffansson L I .The regular solution model for stoichiometric phases and ionic melts[J].Acta Chemica Scandinavica,1970,24:3618. |
| [6] | Bulter J A V .The thermodynamics of the surfaces of solutions[J].Proceedings of the Royal Society of London,1932,135:348. |
| [7] | Yeum K S;Speiser R;Poirier D R .Estimation of the surface tensions of binary liquid alloys[J].Metallurgical and Materials Transactions B:Process Metallurgy and Materials Processing Science,1989,20(05):693-703. |
| [8] | Tanaka T;Iida I .Application of a thermodynamic database to the calculation of surface tension for iron-base liquid alloys[J].Steel Research International,1994,65:21. |
| [9] | Seetharaman S;Sichen D .Estimation of the viscosities of binary metallic melts using gibbs energies of mixing[J].Metallurgical and Materials Transactions,1993,25B:89. |
| [10] | Liu X J;Chen S L;Ohnuma I.Design of micro-soldering materials in electronic packaging using computational thermodynamics[A].北京:科学出版社,2001:334. |
| [11] | Ghosh G .Disslution and interfacical reactions of thin-film Ti/Ni/Ag metallizations in solder joints[J].Acta Materialia,2001,49:2609-2624. |
| [12] | Liu X J;Takaku T;Ohnuma I.Reaction and kinetic simulation between Cu and Sn base solders[A].Tokyo,Japan,2002 |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%