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综述了分别由有机溶剂、低温无机熔盐和离子液体构成的低温电镀铝体系的研究进展.有机溶剂和低温无机熔盐电镀铝各有优点,但前者的稳定性差,对水和氧敏感,电导率低;而后者较高的电镀温度限制了基体材料的选择.性能优异的离子液体备受青睐,研究最多的是以卤族为阴离子的离子液体,但是其在空气和水中易氧化和易吸潮变质而不稳定.稳定性更好的新型离子液体不断涌现,但缺乏系统研究.目前,除了电镀单一铝镀层之外,为了获得铝合金的特殊性能,电镀铝合金镀层越来越受到关注.对铝及铝合金镀层的巨大需求和远景期待将促使镀铝体系的推陈出新和镀铝工艺的不断进步,进而降低镀铝体系的成本,低温电镀铝的工业化应用将成为现实.

参考文献

[1] Zhao Y G;Vamdermppt T J .Review:Electrodeposition of aluminium from nonaqueous organic electrolytic systems and room temperature molten salts[J].Electrochimica Acta,1997,42(01):3-13.
[2] 杜敏;魏绪钧 .铝在醚类电解质中的电沉积[J].材料科学与工艺,1996,4(01):43-47.
[3] 张守民,周永洽.有机溶液中铝的电镀[J].腐蚀与防护,2000(02):57-59,77.
[4] 陈建华 .低温熔盐体系铝电沉积[J].表面技术,1994,23(04):159-163.
[5] Couch D E;Brenner A .A hydride bath for the electrodeposition of aluminium[J].Journal of the Electrochemical Society,1952,99(06):234-244.
[6] Brenner A;Couch D E .Electrodeposition of aluminum from nonaqueous solutions[P].U S,2,651,608,1953-09-08.
[7] Brenner A;C W Tobias.In advances in electrochemistry and electrochemical engineering[M].New York:Interscience Publishers,1967:217-230.
[8] Couch D E;Brenner A .Glow discharge spectra of copper and indium above aqueous solutions[J].Journal of the Electrochemical Society,1959,106(07):628-629.
[9] Connor J H;Brenner A .Electrodeposition of metals from organic solutions[J].Journal of the Electrochemical Society,1956,103(12):657-662.
[10] Clay F A;Harding W B;Stimetz C J .Electrodeposition of aluminum[J].Plating,1969,56(09):1027-1033.
[11] Ishiba shi N;Yoshio M .Electrodeposition of aluminium from the NBS type bath using tetrahydrofuran-benzene mixed solvent[J].Electrochimica Acta,1972,17(08):1343-1352.
[12] Yoshio M;Ishibashi N .High-rate plating of aluminium from the bath containing aluminium chloride and lithium aluminium hydride in tetrahydrofuran[J].Journal of Applied Electrochemistry,1973,3(04):321-325.
[13] 张守民,周永洽.钕铁硼磁体的AlCl3+LiAlH4有机溶液镀铝研究[J].南开大学学报(自然科学版),1999(02):14-17.
[14] Biallozor S;Mazim V;Lieder M .The electrodeposition of aluminium from xylene and ether-hydride electrolytes[J].Journal of Applied Electrochemistry,1993,23(03):253-256.
[15] Galova M;Kladekova D;Lux L .Basic parameters of the electrode process in aluminium deposition from tetrahydrofuran solutions.II.Mechanism of the electrode reaction[J].Surface Technology,1981,13(04):315-324.
[16] Capuano G A;Davenport W G .Electrodeposition of aluminum from alkyl benzene electrolytes[J].Journal of the Electrochemical Society,1971,118(10):1688-1695.
[17] Capuano G A;Davenport W G .Plating aluminum onto steel or copper from alkyl benzene electrolytes[J].Plating,1973,60:251-255.
[18] Peled E;Gileadi E .Electroplating of aluminum from aromatic hydrocarbons[J].Plating,1975,62:342-348.
[19] Zielger K;Lehmkuhl H .Die elektrolytische absherdung von aluminium aus organischen komplexverbindungen[J].Zeitschrift Fur Anorganische Und Allgemeine Chemie,1956,283:414-420.
[20] L. Legrand;A. Chausse;R. Messina .Investigations on the electroreduction of titanium chlorides in AlCl{sub}3-dimethylsulfone electrolyte[J].Journal of the Electrochemical Society,1998(1):110-115.
[21] Legrand L;Tranchant A;Messina R .Aluminium behaviour and stability in AlCl3/DMSO2 electrolyte[J].Electrochimica Acta,1996,41(17):2715-2720.
[22] Legrand L.;Messina R.;Romain F.;Lautie A.;Tranchant A. .RAMAN STUDY OF ALUMINUM CHLORIDE DIMETHYLSULFONE SOLUTIONS[J].Inorganic Chemistry: A Research Journal that Includes Bioinorganic, Catalytic, Organometallic, Solid-State, and Synthetic Chemistry and Reaction Dynamics,1996(5):1310-1312.
[23] Legrand L;Tranchant A;Messina R .Behaviour of aluminium as anode in dimethylsulfone-based electrolytes[J].Electrochimica Acta,1994,39(10):1427-1431.
[24] Legrand L;Tranchant A;Messina R .Electrodeposition studies of aluminum on tungsten electrode from DMSO2 electrolytes[J].Journal of the Electrochemical Society,1994,141(02):378-382.
[25] T. Hirato;J. Fransaer;J.-P. Celis .Electrolytic Codeposition of Silica Particles with Aluminum from AlCl_3-Dimethylsulfone Electrolytes[J].Journal of the Electrochemical Society,2001(4):C280-C283.
[26] L.Legrand;A.Chausse;R.Messina .Investigations on the stability of titanium(II) species in AlCl_3-dimethylsulfone electrolytes[J].Electrochimica Acta,2001(15):2407-2413.
[27] Kudo T.;Hisamitsu Y.;Kihara K.;Mohamedi M.;Uchida I. .Electrochemical behaviour of Ni+Al alloy as an alternative material for molten carbonate fuel cell cathodes[J].Journal of Applied Electrochemistry,2002(2):179-184.
[28] Fransaer J.;Leunis E.;Hirato T.;Celis JP. .Aluminium composite coatings containing micrometre and nanometre-sized particles electroplated from a non-aqueous electrolyte[J].Journal of Applied Electrochemistry,2002(2):123-128.
[29] Wolfgang Froemberg;F.A. Sandy Donaldson .ELECTROPLATING with Aluminum[J].Advanced Materials & Processes,1996(2):33-35.
[30] 冯秋元 .熔融盐电镀铝及其性能的研究[D].大连铁道学院,2004.
[31] 冯秋元,丁志敏.熔融盐电镀铝的研究进展[J].电镀与环保,2003(05):1-4.
[32] 赵卓,李小斌,赵清杰.铝的电镀技术研究进展[J].轻金属,2007(02):57-60.
[33] 冯秋元,丁志敏,贾利山,关君实.低温熔融盐电镀铝的研究[J].材料保护,2004(04):1-3.
[34] 宋国泰;牛洪军;孙一唐 等.黄铜熔盐电解沉积铝工艺研究[J].吉林工业大学学报,1992,22(03):114-118.
[35] Rolland P;Mamantov .Electrochemical reduction of Al2Cl-7 ions in chloroaluminate melts[J].Journal of the Electrochemical Society,1976,123(09):1299-1302.
[36] 李庆峰,邱竹贤,N.J.Bjerrum.铝在NaCl-AlCl3熔盐体系中的电化学沉积[J].稀有金属材料与工程,1995(03):59-63.
[37] Jafarian M;Mahjani MG;Gobal F;Danaee I .Effect of potential on the early stage of nucleation and growth during aluminum electrocrystallization from molten salt (AlCl3-NaCl-KCl)[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,2006(2):190-196.
[38] M. Jafarian;F. Gobal;I. Danaee;M. G. Mahjani .Impedance spectroscopy study of aluminum electrocrystallization from basic molten salt (AlCl{sub}3-NaCl-KCl)[J].Electrochimica Acta,2007(17):5437-5443.
[39] 牛洪军;孙国恩;宋国泰 .AlCl3-NaCl熔盐电解渗铝及其耐蚀性[J].腐蚀与防护,1994,15(02):61-63.
[40] 丁志敏,冯秋元,石子源,阎颖,金华.钢铁件熔融盐电镀铝及其抗高温氧化性的研究[J].热加工工艺,2004(07):27-28,31.
[41] 冯秋元,丁志敏,赵振燕.钢的盐浴热处理及表面电镀铝复合处理新工艺[J].机车车辆工艺,2003(06):5-8.
[42] 丁志敏,冯秋元,石子源,阎颖,金华.Q235钢表面熔盐电镀铝及其耐蚀性的研究[J].金属热处理,2004(07):41-43.
[43] 王吉会,夏扬,王茂范.无机熔盐镀铝层的制备与性能研究[J].兵器材料科学与工程,2005(06):1-5.
[44] M. JAFARIAN;M. G. MAHJANI;F. GOBAL .Electrodeposition of aluminum from molten AlCl_3-NaCl-KCl mixture[J].Journal of Applied Electrochemistry,2006(10):1169-1173.
[45] Ueda M.;Susukida D.;Konda S.;Ohtsuka T. .Improvement of resistance of TiAl alloy against high temperature oxidation by electroplating in AlCl3-NaCl-KCl-CrCl2 molten salt[J].Surface & Coatings Technology,2004(2):202-208.
[46] Mikito Ueda;Hirokuni Kigawa;Toshiaki Ohtsuka .Co-deposition of Al-Cr-Ni alloys using constant potential and potential pulse techniques in AlCl{sub}3-NaCl-KCl molten salt[J].Electrochimica Acta,2007(7):2515-2519.
[47] Hurley F N;Wier Jr T P .The electrodeposition of aluminum from nonaqueous solutions at room temperature[J].Journal of the Electrochemical Society,1951,98(05):207-212.
[48] Wilkes J S;Zaworotko M J.Air and water stable 1-ethyl-3-methylimidazolium based ionic liquids[J].Journal of the Chemical Society,Chemical Communications,1992(13):965-967.
[49] Endres F. .Electrodeposition of a thin germanium film on gold from a room temperature ionic liquid[J].Physical chemistry chemical physics: PCCP,2001(15):3165-3174.
[50] Ming-Jay Deng;Po-Yu Chen;I-Wen Sun .Electrochemical study and electrodeposition of manganese in the hydrophobic butylmethylpyrrolidinium bis((trifluoromethyl)sulfonyl) imide room-temperature ionic liquid[J].Electrochimica Acta,2007(4):1931-1938.
[51] Moustafa EM;El Abedin SZ;Shkurankov A;Zschippang E;Saad AY;Bund A;Endres F .Electrodeposition of al in 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)amide and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)amide ionic liquids: In situ STM and EQCM studies[J].The journal of physical chemistry, B. Condensed matter, materials, surfaces, interfaces & biophysical,2007(18):4693-4704.
[52] Muhammad Rostom ALI;Atshushi Nishikata;Tooru Tsuru .Electrodeposition of Co-Al alloys of different composition from the AlCl3-BPC-CoCl2 room temperature molten salt[J].Electrochimica Acta,1997,42(12):1819-1828.
[53] Muhammad Rostom Ali;Atshushi Nishikata;Tooru Tsuru .Electrodeposition of Al-Ni intermetallic compounds from aluminum chloride-N-(n-butyl)pyridinium chloride room temperature molten salt[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,2001(2):111-118.
[54] Deng MJ;Chen PY;Leong TI;Sun IW;Chang JK;Tsai WT .Dicyanamide anion based ionic liquids for electrodeposition of metals[J].Electrochemistry communications,2008(2):213-216.
[55] Jiang T;Brym MJC;Dube G;Lasia A;Brisard GM .Electrodeposition of aluminium from ionic liquids: Part I - electrodeposition and surface morphology of aluminium from aluminium chloride (AlCl3)-l-ethyl-3-methylimidazolium chloride ([EMIm]Cl) ionic liquids[J].Surface & Coatings Technology,2006(1/2):1-9.
[56] Liu QX;El Abedin SZ;Endres F .Electroplating of mild steel by aluminium in a first generation ionic liquid: A green alternative to commercial Al-plating in organic solvents[J].Surface & Coatings Technology,2006(3/4):1352-1356.
[57] Tetsuya Tsuda;Toshiyuki Nohira;Yasuhiko Ito .Nucleation and surface morphology of aluminum-lanthanum alloy electrodeposited in a LaCl{sub}3-saturated AlCl{sub}3-EtMeImCl room temperature molten salt[J].Electrochimica Acta,2002(17):2817-2822.
[58] Chang JK;Chen SY;Tsai WT;Deng MJ;Sun IW .Electrodeposition of aluminum on magnesium alloy in aluminum chloride (AlCl3)-1-ethyl-3-methylimidazolium chloride (EMIC) ionic liquid and its corrosion behavior[J].Electrochemistry communications,2007(7):1602-1606.
[59] Chang JK;Chen SY;Tsaia WT;Deng MJ;Sun IW .Improved corrosion resistance of magnesium alloy with a surface aluminum coating electrodeposited in ionic liquid[J].Journal of the Electrochemical Society,2008(3):C112-C116.
[60] Stefano Caporali;Alessio Fossati;Alessandro Lavacchi;Ilaria Perissi;Alexander Tolstogouzov;Ugo Bardi .Aluminium electroplated from ionic liquids as protective coating against steel corrosion[J].Corrosion Science: The Journal on Environmental Degradation of Materials and its Control,2008(2):534-539.
[61] Jones S D;Blomgren G E .Low-temperature molten salt electrolytes based on aralkyl quaternary or ternary onium salts[J].Journal of the Electrochemical Society,1989,136(02):424-427.
[62] Papageorgiou N;Emmenegger F P .The effect of cosolvents and additives on the electrochemical properties of[(Me)3PhN][Al2Cl7] melts[J].Electrochimica Acta,1993,38(2/3):245-252.
[63] Zhao Y G;Vandernoot T J .Electrodeposition of aluminium from room temperature AlCl3-TMPAC molten salts[J].Electrochimica Acta,1997,42(11):1639-1643.
[64] Jiang T;Brym MJC;Dube G;Lasia A;Brisard GM .Electrodeposition of aluminium from ionic liquids: Part II - studies on the electrodeposition of aluminum from aluminum chloride (AICl(3)) - trimethylphenylammonium chloride (TMPAC) ionic liquids[J].Surface & Coatings Technology,2006(1/2):10-18.
[65] Moffat T P .Electrodeposition of Al-Cr metallic glass[J].Journal of the Electrochemical Society,1994,141(09):1115-1117.
[66] Mou R;Emmenegger F P .Co-solvents for chloroaluminate electrolytes[J].Electrochimica Acta,1992,37(06):1061-1068.
[67] Sears Paul G;Wilhoit Eugene D;Dawson Lyle R et al.Conductances of trimethylphenylammonium chloride and iodide in water and in dimethylformamide at 25 ℃[J].Journal of Chemical Physics,1955,23(02):1274-1278.
[68] Andrew P.Abbott;Christopher A. Eardley;Nicola R.S.Farley;Gerald A. Griffith;Allin Pratt .Electrodeposition of aluminium and aluminium/platinum alloys from AlCl_3/benzyltrimethylammonium chloride room temperature ionic liquids[J].Journal of Applied Electrochemistry,2001(12):1345-1350.
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