采用原位合成的方法设计并制备了SiC-BN复合陶瓷.经理论计算及实验证明,在相对较低的温度(1700 ℃)下即可成功实现预期的原位反应.复合陶瓷中生成了细小均匀的微米级SiC和BN颗粒,在添加剂较多的地方发现了纳米级的SiC晶粒.SiC-BN系列复合陶瓷的抗弯强度和断裂韧性在含20vo1%BN时达到最大,分别为311MPa和4.5 MPa·m1/2,弹性模量和硬度随BN含量的增加而减小,B60复合陶瓷的弹性模量为40.8GPa,维氏硬度为0.55GPa.不含BN的BO复合陶瓷的断裂方式主要为穿晶断裂,含有BN的SiC-BN复合陶瓷的断裂方式主要为沿晶断裂.
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