为研究废弃印刷电路板（ PCB）在回收加热拆解电子元件过程中所产生的气体排放物的主要成分，使用自行设计的废弃 PCB 拆解装置进行拆解实验，采用傅里叶红外光谱（ FTIRS）、气相色谱?质谱（ GC／MS）、离子色谱（ IC）和电感耦合等离子体质谱（ ICP?MS）等分析方法，对实验过程所收集到的气体产物进行成分分析。结果表明，废弃 PCB 的基板在加热过程中发生了初步分解，基板上的溴化环氧树脂发生了 O—C、C—C、C—Br键的断裂，产生了苯酚、2，6?二溴苯酚等有机物；伴随有机气体逸出的还有废弃PCB在加热过程所释放的含有大量 S、N、Cl、Br 等元素的无机酸性气体；而连续的熔锡过程还使得 PCB 与焊料中的 Sn、Pb、Sb、Hg、Cd、Cr 等重金属产生烟尘逸出。
In order to determine the emission components in the process of heating and dismantling wasted printed circuit boards(PCBs), with the aid of self?designed PCB dismantling device, the discharged gases were collected and analyzed by means of fourier transform infrared spectroscopy ( FTIRS ) , gas chromatography?mass spectroscopy ( GC/MS ) , ion chromatography ( IC ) and inductively coupled plasma mass spectroscopy(ICP?MS). The results showed that the wasted PCBs produced phenol, 2,6?dibromophenol and other kinds of organic compounds following the breaking of O—C, C—C, C—Br bonds in brominated epoxy resins when being heated, and also released a large number of acid gases containing chemical elements such as S, N, Cl and Br. Moreover, heavy metals such as Sn, Pb, Sb, Hg, Cd and Cr escaped from PCBs and melting solder in the continuous tin fusion process.
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