采用电阻式热蒸发方法和退火工艺制备出了Mg2Si半导体薄膜.研究了退火时间对Mg2Si薄膜的形成和结构的影响.首先在Si(111)衬底上沉积380nm Mg膜,然后在退火炉低真空10-1～10-2Pa氛围400℃退火,退火时间分别为3、4、5、6和7h.通过X射线衍射仪(XRD)、场发射扫描电镜(FESEM)和拉曼光谱仪对薄膜的结构、形貌和光学性质进行了表征.结果表明,采用电阻式热蒸发方法成功地制备了半导体Mg2Si薄膜,Mg2Si薄膜具有Mg2Si(220)的择优生长特性.最强衍射峰出现在40.12°位置,随着退火时间的延长,Mg2Si (220)衍射峰强度先逐渐变强后变弱,退火4h时该峰强度最强.在256和690cm-1附近有两个Mg2Si拉曼特征峰,退火时间为4和7h时,256cm-1附近Mg2Si拉曼特征峰较强.
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