用显微结构方法研究了Cu与液态Sn的相互作用;作出了浸沾时间与Cu溶解扩散的关系图。温度升高至350℃时金属间化合物Cu_6Sn_5的生长有突跃,以羽毛状迅速生长并突破沾Sn层。研究了抑制金属间化合物生长的各种方法。根据上述研究,详细讨论了meniscograph方法所得润湿曲线的物理意义。
The interaction between Cu and liquid Sn was studied by microstruc-ture observation. The curve of the dipping time with related to dissolving anddiffusion of Cu in liquid Sn was given. The Cu dissolves rapidly in liquid Sn atthe beginning, then an intermetallic compound, Cu_6Sn_5, forms, and the dissolvingfollows to slow down. At temperature up to 350℃, the feather-like Cu_6Sn_5 is sud-denly growing up and spreads through the dipped Sn layer. The way to inhibitthe growth of the intermetallic compound, Cu_6Sn_5, was also approached. Thus, onthe above mentioned basis, the phyical meaning of the wetting curve traced by themeniscograph wettability tester has been derived as film detaching, Cu dissolvingand Cu_6Sn_5 growing.
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