为了加速我国电子行业无铅化进程,利用自行设计的超音速雾化制粉试验装置,研究了过热度对Sn3Ag2.8Cu合金无铅焊锡雾化粉体颗粒形貌的影响.结果表明:通过调整合金的过热度,能够控制雾化粉体中卫星颗粒及异形颗粒的比例;当合金过热度为150℃时,雾化粉体中卫星颗粒和异形颗粒最少,颗粒球形度最好;当合金过热度为100℃时,雾化粉体颗粒球形度较差;当合金过热度为250℃时,雾化粉体卫星颗粒和片状颗粒较多.
To accelerate the lead-free process in the electronic industry in our country, the effect of superheat condition on morphology of the Sn3Ag2.8Cu alloy lead-free solder powder particles was studied by using self-designed supersonic atomization device. The results show that the proportion of the satellite particles and special shaped particles could be controlled through adjusting the superheat condition for the alloy. Under 150 ℃ superheat condition, the proportion of the satellite particles and special shaped particles were the least, and the sphericity of the particles was optimal And the sphericity of the particles was worse under 100 ℃ superheat condition. There were more satellite particles and flake particles in the atomized powders under 250 ℃ superheat condition.
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