欢迎登录材料期刊网

材料期刊网

高级检索

研究了聚乙二醇改性对聚对苯二甲酸乙二醇酯(PET)薄膜化学镀铜的影响.主要工序为:依次用1#、3#、5#金相砂纸打磨PET薄膜,在紫外光下用聚乙二醇改性接枝,以及化学镀铜.镀液的组成与工艺条件为:CuSO4·5H2O 16 g/L,Na2EDTA14 g/L,NaKC4H4O6·2H2O 19.5 g/L,NaOH 14.5 g/L,HCHO15 mL/L,温度40℃,时间30 min.红外光谱图表明PEG-6000被成功接枝在PET薄膜表面.分别采用X射线衍射仪、扫描电镜分析了化学镀铜后PET薄膜的结构和表面形貌,并测试了PET薄膜的结合力、厚度、导电性等性能.结果表明,PET表面的化学镀铜层纯度高;与未改性PET基铜镀层相比,改性的PET基铜镀层结晶更细致、光亮;镀铜层的厚度、电导率、背光等级及其与PET薄膜之间的结合力分别为1.21 μm、1.9×105 S/cm、10级、16.1 N/cm,可用以生产挠性电路板(FCB).

参考文献

[1] MENARD E;MEITL M A;SUN Y G et al.Micro-and nanopatteming techniques for organic electronic and optoelectronic systems[J].Chemical Reviews,2007,107(04):1117-1160.
[2] CHENG K;YANG M H;CHIU W W W et al.Ink-jet printing,self-assembled polyelectrolytes,and electroless plating:low cost fabrication of circuits on a flexible substrate at room temperature[J].Macromolecular Rapid Communications,2005,26(04):247-264.
[3] Domenech, SC;Severgnini, VLS;Pinheiro, EA;Avila, AOV;Borges, NG;Lima, E;Drago, V;Soldi, V .Effect of chemical surface treatment on thermal stability of poly(ethylene terephthalate) films used in flexible circuits[J].Polymer Degradation and Stability,2005(3):461-467.
[4] Lee CY;Moon WC;Jung SB .Surface finishes of rolled copper foil for flexible printed circuit board[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2008(0):723-726.
[5] Jun MATSUi;Kosuke KUBOTA;Yuko KADO .Electroless Copper Plating onto Polyimide Using Polymer Nanosheet as a Nano-Adhesive[J].Polymer Journal,2007(1):41-47.
[6] Liang Li;Guoping Yan;Jiangyu Wu;Xianghua Yu;Qingzhong Guo;Entang Kang .Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2008(22):7331-7335.
[7] Dong-Hee Park;Won-Kook Choi .Low energy O_2~+ and N_2O~+ ion beam modification of polyimide for improving adhesive strength of Cu/PI in roll-to-roll process[J].Thin Solid Films,2009(14):4222-4225.
[8] Ikari, S;Kashiwade, H;Matsuoka, T;Hirayama, T;Ishida, S;Kato, K .Improvement of copper plating adhesion of PPE printed wiring board by plasma treatment[J].Surface & Coatings Technology,2008(22/23):5583-5585.
[9] Improvement of copper plating adhesion on silane modified PET film by ultrasonic-assisted electroless deposition[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2010(11):3554.
[10] 余尚银;秦效慈 .96A12O3瓷上化学镀铜工艺和机理的研究[J].西安交通大学学报,1995,29(01):34-40.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%