为了提高铜金粉的耐腐蚀性能,采用甲基丙烯酸甲酯(MMA)原位聚合对铜金粉进行了有机聚合物的包覆,以吸光度、光泽度与接枝率为主要评价指标,探讨单体用量、引发剂用量、偶联剂用量对原位聚合过程的影响,并采用IR、SEM和XRD等手段对包覆前后的铜金粉进行表征.结果表明:当m(MMA)/m(Cu)=0.2时,表面包覆PMMA后的铜金粉具有良好的耐腐蚀性能与光泽度;当m(AIBN)/m(MMA)=0.05时,耐腐蚀性能最佳,而此时的接枝率也达到最高点,即耐腐蚀性能与接枝率之间存在一定的对应关系;偶联剂MPS的加入有利于提高铜金粉的耐腐蚀性能,这是由于其分子结构中具有甲氧基(OCH3)与碳碳双键(C＝C),形成具有特殊功能的"分子桥"所致,从而将铜金粉与PMMA通过化学键牢固地结合起来.
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