随着微电子技术的高速发展,SiCp/Al作为新型的电子封装材料受到了广泛的重视.根据近年来报导的有关资料,对SiCp/Al电子封装复合材料的性能、制备工艺及应用发展进行了综述,并指出了未来的研究方向.
参考文献
| [1] | Zweben C .Metal-Matrix composites for electronic pack aging[J].Journal of the Minerals,Metals & Materials Society,1992,44(07):15. |
| [2] | Zweben C .Advance in compsite materials for thermal management in electronic packaging[J].Journal of the Minerals,Metals & Materials Society,1998,50(06):47. |
| [3] | John A.Preform based metal matrix composite fabrica tion for electronic carrier application[M].6th International SAMPE Electronics Conference,1992(06):22. |
| [4] | Lee K B et al.Fabrication of A1-3wt pct Mg matrix com posite reinforced with Al2O3 and SiC particulates by the pressureless infiltration technique[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,1998,29:3087. |
| [5] | 张国定;赵昌正.金属基复合材料[M].上海:上海交通大学出版社,1996 |
| [6] | Lee Hyo S et al.Fabrication process and thermal proper ties of SiCp/A1 metal matrix composites for electronic packaging applications[J].Journal of Materials Science,2000,35:6231. |
| [7] | Cook A J .Electronic package having a pure metal skin[P].US 5406029,1995. |
| [8] | Hunt M .Progress in powder metal composites[J].Materials and Engineering,1990,107(01):33. |
| [9] | 吴锦波 等.铸造法制金属基复合材料研究进展[J].材料科学与工程,1996,114(02):15. |
| [10] | Wu Y .Interaction mechanisms between ceramic particles and atomized metallic proplets 3[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,1992,23:2923. |
| [11] | Hunt M .Electronic packaging[J].Materials and Engineering,1991,108(01):24. |
| [12] | Elomari S.;Sanmarchi C.;Mortensen A.;Lloyd DJ.;Boukhili R. .THERMAL EXPANSION RESPONSES OF PRESSURE INFILTRATED SIC/AL METAL-MATRIX COMPOSITES[J].Journal of Materials Science,1997(8):2131-2140. |
| [13] | Murty B S;Thankur S K et al.On the infiltration behav ior of Al Al-Li and Mg melt through SiCp bed[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,2000,31:319. |
| [14] | Candan et al.Effect of magnesium alloying additions on infiltration threshold pressure and structure of SiC pow der compacts infiltrated by aluminium-based melts[J].Journal of Materials Science,1997,32:289. |
| [15] | Nishiba Y et al.Modeling of infiltration of Molten metal in fibrous perform by centrifugal force[J].Acta Materialia,1999,47(03):841. |
| [16] | Burke J T et al.A new infiltration process for the fabri cation of metal matrix composites[J].SAMPE Quarterly,1989,34:817. |
| [17] | Pech canul M I;Katz R N et al.Optimum conditions for pressureless infiltration of SiCp preforms by aluminum alloys[J].Journal of Materials Processing Technology,2000,108:68. |
| [18] | Lee KB.;Kim SH.;Han KH.;Kwon H.;Sim HS. .Fabrication and characteristics of AA6061/SiCp composites by pressureless infiltration technique[J].Journal of Materials Science,2001(13):3179-3188. |
| [19] | Chen YY.;Chung DDL. .ALUMINIUM-MATRIX SILICON CARBIDE WHISKER COMPOSITES FABRICATED BY PRESSURELESS INFILTRATION[J].Journal of Materials Science,1996(2):407-412. |
| [20] | Bugeau J L.Aluminum silicon carbide for high per formance microwave packages[A].,1995 |
| [21] | Gunger M N et al.Composite substrate carrier for high power electronic devices[P].US 5944097,1999. |
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