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研究了不同浓度的 S-羧乙基异硫脲鎓盐(ATPN)对酸性化学镀镍的沉积速率和镀层表面形貌的影响,通过极化曲线研究了化学镍的阴、阳极过程。结果表明,ATPN 能使镀层表面结晶细致。在ATPN的添加量小于11 mg/L时,ATPN 通过其分子中的S原子的电子效应,降低次磷酸根在镍表面的吸附能,因此随着ATPN的增加,次磷酸钠氧化加快,化学镀镍沉积速率加快。当ATPN添加量超过11 mg/L后,ATPN与镍形成很稳定的表面吸附配合物,减少了次磷酸钠在镍表面的吸附,因此随ATPN添加,次磷酸钠氧化受到抑制,沉积速率变小。当镍表面被ATPN完全覆盖,则会发生停镀或者不起镀。适宜的ATPN添加量为8~13 mg/L。

The effects of different concentrations of S-carboxyethylisothiuronium betaine (ATPN) on deposition rate of acidic electroless nickel plating and surface morphology of the Ni–P coating obtained were discussed. The anodic and cathodic courses of electroless nickel plating were studied by polarization curve measurement. The results indicated that the addition of ATPN can refine grains. When the amount of ATPN is less than 11 mg/L, the oxidation rate of hypophosphite is increased with increasing ATPN amount due to the fact that ATPN reduces the adsorption energy of hypophosphite on the surface of nickel by the electronic effect of atom S in the ATPN molecule, leading to an increased deposition rate of nickel. When the amount of ATPN is over 11 mg/L, the oxidation of hypophosphite is inhibited and the deposition rate is decreased due to the formation of a very stable adsorption compound of ATPN and nickel on nickel surface, reducing the adsorption of hypophosphite. When the surface of nickel is completely covered by ATPN, the electroless deposition of nickel is stop.The suitable dosage of ATPN is 8-13 mg/L.

参考文献

[1] 李宁;屠振密.化学镀实用技术[M].北京:化学工业出版社,2004:1-4,28-40.
[2] X.Yin;L.Hong;B.-H.Chen .Role of a Pb~(2+) Stabilizer in the Electroless Nickel Plating System:A Theoretical Exploration[J].The journal of physical chemistry, B. Condensed matter, materials, surfaces, interfaces & biophysical,2004(30):10919-10929.
[3] 韩克平.硫脲稳定化学镀镍的机理[J].电镀与精饰,1996(03):11.
[4] Liu, H.;Bi, S.;Li, N. .Effect of 3-S isothiuronium propyl sulfonate on electroless nickel deposition[J].Russian journal of electrochemistry,2010(4):383-388.
[5] LIU Hai-ping,LI Ning,BI Si-fu,LI De-yu,ZOU Zhong-li.Effect of 3-Amino-5-mercapto-1,2,4-triazole on Electroless Nickel Deposition[J].高等学校化学研究(英文版),2008(01):101-105.
[6] HAN K P;FANG J L .Effect of cysteine on the kinetics of electroless nickel deposition[J].Journal of Applied Electrochemistry,1996,26(12):1273-1277.
[7] Ke Wang;Liang Hong;Zhao-Lin Liu .Investigation into the Roles of Sulfur-Containing Amino Acids in Electroless Nickel Plating Bath[J].Industrial & Engineering Chemistry Research,2008(17):6517-6524.
[8] Hongwu Xu;Juan Brito;Omowunmi A. Sadik .Mechanism of Stabilizer Acceleration in Electroless Nickel at Wirebond Substrates[J].Journal of the Electrochemical Society,2003(11):C816-C822.
[9] 孙华,冯立明.化学镀Ni-P合金稳定剂的研究[J].表面技术,2004(05):32-34.
[10] 胡波年,李亭憬,余刚,张俊,吴振军,何晓梅.镁合金化学镀镍溶液稳定性[J].化工学报,2009(03):696-701.
[11] 方景礼 .化学镀镍诱发过程的研究I:金属催化活性的鉴别和反应机理[J].化学学报,1983,41(02):129-138.
[12] DONAHUE F M;YU C U .A study of the mechanism of the electroless deposition of nickel[J].Electrochimica Acta,1970,15(01):237-239.
[13] 仵亚婷,汤义武,沈彬,刘磊,胡文彬.化学镀镍溶液稳定剂及其作用机理[J].机械工程材料,2004(11):1-3,9.
[14] 胡光辉 .化学镀镍中添加剂作用和活化过程的机理研究[D].厦门大学,2004.
[15] Calvin H.Bartholomew .Mechanisms of catalyst deactivation[J].Applied Catalysis, A. General: An International Journal Devoted to Catalytic Science and Its Applications,2001(1/2):17-60.
[16] OUDAR J .Sulfur adsorption and poisoning of metallic catalysts[J].Catalysis Reviews:Science and Engineering,1980,22(02):171-195.
[17] 余家康;董俊华;曹楚南 等.硫脲及其衍生物的SERS和量子化学研究[J].物理化学学报,1996,12(09):856-860.
[18] 董俊华;宋光铃;曹楚南 等.铁电极上硫脲及衍生物的缓蚀作用研究[J].物理化学学报,1996,12(03):252-258.
[19] 谢洪波,江冰,陈华三,张来祥.化学镀镍规律及机理探讨[J].电镀与精饰,2012(02):26-30,46.
[20] Bin Jiang;Masahiro Kunimoto;Masahiro Yanagisawa .Effect of Thiourea on Oxidation of Hypophosphite Ions on Ni Surface Investigated by Raman Spectroscopy and DFT Calculation[J].Journal of the Electrochemical Society,2013(9):D366-D371.
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