通过液相化学还原法制备纳米银粉,经扫描电子显微镜(SEM)和X射线衍射(XRD)表征,表明该方法制备的纳米银粉纯净,粒度分布均匀,呈短棒状.该纳米银粉作为导电填料加入可以有效地改善导电胶体系的体积电阻率和连接强度.在总银粉填充量60%,纳米银粉与微米银粉比例为1:5的情况下,导电胶的体积电阻率达到最低值1.997×10-4Ω·cm,同时连接强度达到18.9MPa.
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