采用离散元法(Discrete element method,DEM)建立C/C复合板材离散元模型,并对其进行校准.利用DEM的独特优势,能够再现C/C层合板单边切口梁实验中微裂纹生成及扩展现象.DEM模拟与实验结果吻合,验证了此C/C离散元模型的有效性,形象地再现了C/C损伤过程,同时表明了用DEM研究更为复杂的复合材料的优势.
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