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为研究常化温度对热轧无取向硅钢组织与织构的影响,采用光学显微镜、背电子散射衍射技术研究了不同常化温度对其影响.结果表明,实验硅钢板在700~850℃温度下常化时,随常化温度的升高,晶粒尺寸增大,有利组分α织构增强,不利组分γ织构降低.对比研究了800℃和850℃常化热轧板CSL晶界分布图与取向差分布图,在本文研究条件下,Goss织构易在Σ=3,9的CSL晶界及晶粒取向差为30° ~55°处形成.

参考文献

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