欢迎登录材料期刊网

材料期刊网

高级检索

分别选取3种典型的含银软钎料(Sn-Ag-Cu、Sn-Zn、Sn-Bi)和硬钎料(Ag-Cu-Zn、Cu-P、Zn-Al)作为代表进行阐述.综述了国内外含银钎料研究的最新研究成果,归纳分析银元素对软钎料与硬钎料的物理性能、显微组织和力学性能的影响规律,提出含银钎料在研究和应用过程中存在的问题及相应的解决措施,展望含银钎料的研究和发展趋势.

参考文献

[1] Dhafer Abdul Ameer Shnawah;Mohd Faizul Bin Mohd Sabri;Irfan Anjum Badruddin.A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints[J].Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe,20121(1):47-57.
[2] F.-Y. Hung;C.-J. Wang;S.-M. Huang.Thermoelectric characteristics and tensile properties of Sn-9Zn-xAg lead-free solders[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20061/2(1/2):193-198.
[3] Kwang-Lung Lin;Chia-Ling Shih.Microstructure and Thermal Behavior of Sn-Zn-Ag Solders[J].Journal of Electronic Materials,200312(12):1496-1500.
[4] Hui-Wei Miao;Jenq-Gong Dhu;Bi-Shiou Chiou.Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints[J].Journal of Materials Science. Materials in Electronics,20008(8):609-618.
[5] VIANCO P.T.;REJENT J.A..Properties of Ternary Sn-Ag-Bi Solder Alloys: Part l-Thermal Properties and Microstructural Analysis[J].Journal of Electronic Materials,199910(10):1127-1137.
[6] M. Reid;J. Punch;M. Collins;C. Ryan.Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys[J].Soldering & Surface Mount Technology,20084(4):3-8.
[7] J.M. Song;G.F. Lan;T.S. Lui.Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys[J].Scripta materialia,20038(8):1047-1051.
[8] 吴文云;邱小明;殷世强;孙大谦;李明高.Bi、Ag对Sn-Zn无铅钎料性能与组织的影响[J].中国有色金属学报,2006(1):158-163.
[9] 何鹏;吕晓春;张斌斌;马鑫;钱乙余.合金元素对Sn-57Bi无铅钎料组织及韧性的影响[J].材料工程,2010(10):13-17,31.
[10] Chih-ming Chen;Chih-chieh Huang.Effects of silver doping on electromigration of eutectic SnBi solder[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20081/2(1/2):235-241.
[11] A Comparison of the Creep Behavior of Joint-Scale SAC105 and SAC305 Solder Alloys[J].IEEE Transactions on Components, Packaging and Manufacturing Technology,20143(3):516-527.
[12] Kwang-Lung Lin;Chia-Ling Shih.Wetting Interaction between Sn-Zn-Ag Solders and Cu[J].Journal of Electronic Materials,20032(2):95-100.
[13] Hui Wang;Songbai Xue;Feng Zhao;Wenxue Chen.Effects of Ga, Al, Ag, and Ce multi-additions on the properties of Sn-9Zn lead-free solder[J].Journal of Materials Science. Materials in Electronics,20102(2):111-119.
[14] Shiue RK.;Tsay LW.;Lin CL.;Ou JL..A study of Sn-Bi-Ag-(In) lead-free solders[J].Journal of Materials Science,20036(6):1269-1279.
[15] VIANCO P.T.;REJENT J.A..Properties of Ternary Sn-Ag-Bi Solder Alloys: Part II-Wettability and Mechanical Properties Analyses[J].Journal of Electronic Materials,199910(10):1138-1143.
[16] Ma, H;Suhling, JC.A review of mechanical properties of lead-free solders for electronic packaging[J].Journal of Materials Science,20095(5):1141-1158.
[17] 王凤江;钱乙余;马鑫.微观压痕法测量Sn-Ag-Cu系无铅钎料的力学性能[J].中国有色金属学报,2005(5):688-693.
[18] Guang Zeng;Songbai Xue;Liang Zhang;Lili Gao;Wei Dai;Jiadong Luo.A review on the interfacial intermetallic compounds between Sn-Ag-Cu based solders and substrates[J].Journal of Materials Science. Materials in Electronics,20105(5):421-440.
[19] J.M. Song;T.S. Lui;G.F. Lan.Resonant vibration behavior of Sn-Zn-Ag solder alloys[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20041/2(1/2):233-239.
[20] Wen Xue Chen;Song Bai Xue;Hui Wang;Jian Xin Wang;Zong Jie Han;Li Li Gao.Effects of Ag on microstructures, wettabilities of Sn-9Zn-xAg solders as well as mechanical properties of soldered joints[J].Journal of Materials Science. Materials in Electronics,20105(5):461-467.
[21] Shalaby, R.M..Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2013:86-95.
[22] 何鹏;赵智力;钱乙余.Sn-Bi-Ag-Cu钎料波峰焊焊点的剥离现象[J].中国有色金属学报,2005(7):993-999.
[23] Ridout S;Bailey C.Review of methods to predict solder joint reliability under thermo-mechanical cycling[J].Fatigue & Fracture of Engineering Materials and Structures,20075(5):400-412.
[24] C. Kanchanomai;Y. Miyashita;Y. Mutoh.Low cycle fatigue behavior and mechanisms of a eutectic Sn-Pb solder 63Sn/37Pb[J].International Journal of Fatigue,20026(6):671-683.
[25] Liang Zhang;Song-bai Xue;Li-li Gao;Guang Zeng;Zhong Sheng;Yan Chen;Sheng-lin Yu.Effects of rare earths on properties and microstructures of lead-free solder alloys[J].Journal of Materials Science. Materials in Electronics,20098(8):685-694.
[26] 张亮;韩继光;何成文;郭永环;薛松柏;皋利利;叶焕.稀土元素对无铅钎料组织和性能的影响[J].中国有色金属学报,2012(6):1680-1696.
[27] Cho, M. G.;Park, Y. S.;Seo, S.-K.;Paik, K.-W.;Lee, H. M..Effect of Ag Addition on the Ripening Growth of Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow[J].IEEE Transactions on Components, Packaging and Manufacturing Technology,201112(12):1939-1946.
[28] 姬峰;薛松柏;娄继源;娄银斌;王水庆.Zn-Al钎料钎焊Cu/Al接头组织和性能[J].中国有色金属学报(英文版),2012(2):281-287.
[29] 李卓然;矫宁;冯吉才;陆成虹.合金元素对AgCuZn系钎料合金组织与性能的影响[J].焊接学报,2008(3):65-68.
[30] 李一楠;王长文;彭子龙;闫久春;刘雪松.溶解钎焊时Cu在Cu-Ag及Cu-P合金钎料中的溶解行为[J].中国有色金属学报(英文版),2011(z2):394-399.
[31] R.K. Shiue;S.K. Wu;C.H. Chan.The interfacial reactions of infrared brazing Cu and Ti with two silver-based braze alloys[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20041/2(1/2):148-157.
[32] M. B. Karamis;A. Tasdemirci;F. Nair.Microstructural analysis and discontinuities in the brazed zone of copper tubes[J].Journal of Materials Processing Technology,20033(3):302-312.
[33] Naka M.;Hafez KM..Applying of ultrasonic waves on brazing of alumina to copper using Zn-Al filler alloy[J].Journal of Materials Science,200316(16):3491-3494.
[34] V. L. Acoff;R. G. Reddy.Physical properties of selected brazing filler metals M. F. Arenas[J].Science and Technology of Welding and Joining,20045(5):423-429.
[35] 张满;薛松柏;戴玮;娄银斌;王水庆.Ag元素对Zn-Al钎料性能的影响[J].焊接学报,2010(10):73-76.
[36] 高显志.对电动机绕组接头焊接法的改进研究[J].黑龙江科学,2014(6):227.
[37] 汪永东;史文卿;呼义通;徐波.交直流电机转子铜条与端环中频感应钎焊工艺方法的研究[J].大电机技术,2003(1):5-7.
[38] 韩宪鹏;薛松柏;赖忠民;顾文华;顾立勇.无镉银钎料研究现状与发展趋势[J].焊接,2007(6):19-23.
[39] Liang Zhang;Song-bai Xue;Li-li Gao;Yan Chen;Sheng-lin Yu;Zhong Sheng;Guang Zeng.Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium[J].Soldering & Surface Mount Technology,20102(2):30-36.
[40] D.Q. Yu;J. Zhao;L. Wang.Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20041/2(1/2):170-175.
[41] 赖忠民;薛松柏;韩宪鹏;顾立勇;顾文华.AgCuZn-X(Ga,Sn,In,Ni)钎料显微组织及钎焊接头研究[J].稀有金属材料与工程,2010(3):397-400.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%