微生物对铜材及其合金有腐蚀,硫酸还原茵是引起微生物腐蚀的茵种之一,过去对此研究不够.采用极化曲线和电化学交流阻抗谱技术考察了在0,200,500,800 mg/L Ca2+培养基中培养2,3,4,5,6 d后的硫酸盐还原茵茵液对铜材的腐蚀作用.结果表明:在200mg/ Ca2+培养基中培养6 d后硫酸盐还原茵茵液对铜电极的腐蚀作用最弱,Ca2+浓度继续增加,铜电极腐蚀加速;0,200 mg/L Ca2+茵液培养的前3 d对铜电极有较明显的腐蚀作用,而后期则对铜电极有缓蚀作用;Ca2+浓度继续增加,在培养的6 d内均不同程度地加剧铜电极的腐蚀.
Sulfate- reducing bacteria solutious were cultivated from solutions with different concentrations of Ca2+ (0,200,500,800 mg/L) for different durations (1, 2,3, 4, 5,6 d). The effect of the resulting bacteria solutions on the corrosion behavior of copper was investigated by measuring poten-tiodynamic polarization curves and electrochemical impedance spectra. Results show that the sulfate- reducing bacteria solution cultivated in the solution containing 200 mg/L Ca2+ for 6 d has the best inhibition effect for Cu electrode, and corrosion of the Cu electrode is accelerated with increasing concentration of Ca2+.After being cultivated for 3 d in the solution containing 0 mg/L and 200 mg/L Ca2+ , the resulting bacteria solutions accelerated the corrosion of copper, but those bacteria solutions cultivated in the follow-up days had significant corrosion inhibition effect for the Cu electrode. Besides, the bacteria solutions cultivated for 6 d in the solutions with high concentration of Ca2+ ( above 200 mg/L) always accelerated the corrosion of the Cu electrode.
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