以磨碎玻璃纤维(MG)为填料,分别采用甲基四氢邻苯二甲酸酐(MeTHPA)、甲基纳迪克酸酐(MNA)为固化剂,通过聚氨酯(PU)对4,5环氧环己烷1,2-二甲酸二缩水甘油酯(TDE-85)改性,研究了MG/PU/TDE-85/MeTHPA和MG/PU/TDE-85/MNA两种灌封材料的力学性能、热性能和电性能.研究结果表明,两种灌封材料都具有很高的力学性能、热性能和电性能.与MH/PU/TFE-85/MNA灌封材料相比,MG/PU/TDE-85/MeTHPA灌封材料的拉伸强度、半寿温度、体积电阻较高,而冲击强度、玻璃化转变温度略低.
With methyl tetrahydrophthalic anhydride(MeTHPA)or methyl nadic anhydride(MNA)cured respectively and polyurethane modification of diglycidyl-4, 5-epoxycyclohexane-1,2-dicarboxylate(TDE-85), two encapsulating materials of MG/PU.TDE-85/MeTHPA and MG/PU/TDE-85/MNA were prepared by the reinforcement of milled glass fiber(MG). The mechanical properties, thermal properties and electrical properties of two encapsulating materials were studied. The results indicate that two encapsulating materials both have good mechanical properties, thermal properties and electrical properties. The tensile strength, half decomposition temperature and volume resistance of MG/PU/TDE-85/MeTHPA encapsulating material are higher than MG/PU/TDE-85/MNA encapsulating material, but its impact strength, glass transition temperature are lower.
参考文献
| [1] | Rimdusit S.;Ishida H. .Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins[J].Polymer: The International Journal for the Science and Technology of Polymers,2000(22):7941-7949. |
| [2] | 吴晓青,李嘉禄,周清.TDE-85#环氧树脂RTM工艺性研究[J].中国塑料,2003(03):44-47. |
| [3] | 李芝华,任冬燕,郑子樵,朱永明,王伟.聚氨酯改性TDE-85/MeTHPA环氧树脂体系的结构表征[J].中南大学学报（自然科学版）,2007(03):399-403. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%