对热浸镀55％Al-Zn合金过程中形成的中间化合物层的生长动力学进行了分析,提出了一个简化的化合物层生长动力学模型及其数学处理方法,并采用该法对本试验条件下A3钢在不同含硅镀浴中的试验结果进行了曲线拟合处理,求出了若干化合物层的生长关系式及其反应扩散激活能。此外,还就镀浴中元素硅对化合物层形成和生长的影响机理进行了初步探讨。
The growth kinetics of the intermetallic layer formed in 55％ Al-Zn hot-dipping bath has been analysed. A model of the growth kinetics and its calculation method have been presented. Based on the experimental results of A3 steel in the bathes containing various amounts of silicon, the growth relations of the intermetallie layer and the activation energies of diffusion have been found out by curve-fitting method with a computer. Furthermore, the mechanism of the effect of silicon in the bath has also been discussed preliminarily.
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