欢迎登录材料期刊网

材料期刊网

高级检索

采用化学沉积的方法在W-Cu粉末合金上成功地实现了化学镀Ni-P镀层,镀层表面光滑、致密,在结构上属于非晶态;经过25 d的3.5 mass% NaCl溶液浸泡研究表明:在浸泡的前16 d中,化学镀Ni-P镀层的腐蚀速率逐渐增大,在16 d之后腐蚀倾向有所降低;通过腐蚀失重实验得到Ni-P镀层的腐蚀失重小于W-Cu合金,说明化学镀Ni-P镀层可以对W-Cu合金起到保护作用。

The corrosion behavior of Ni-P deposit on W-Cu alloy in 3.5%(wt%) NaCl solution was tested by the polarization curves and electrochemical impedance spectroscopy (EIS). The results indicate that the passive region is not obvious after immersing in 3.5%(wt%) NaCl solution for 0.5 hour and with the increasing of the immersion time the passive membrane becomes integrated and the passive region is becoming obvious after immersing in 3.5%(wt%) NaCl solution for 2 days. After 6 days the point corrosion potential and passive region become smaller and its anti-corrosion ability is getting lower, but the passive parameter is better than that of W-Cu alloy. The polarization curves after immersing in 3.5%(wt%) NaCl solution for 13 days and 29 days were much the same as the one after 6 days and the corrosion behavior of Ni-P alloy in 3.5%(wt%) NaCl solution becomes stable.

参考文献

[1]
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%