目前,对磁控溅射组装Cu-W均质复合膜的工艺及成膜机理研究不够深入.通过磁控溅射组装均质Cu-W薄膜,考察了溅射工艺参数对膜结构的影响.结果表明:直流磁控溅射组装均质Cu-W薄膜时,钨是以β-钨为骨架固溶进部分铜的方式存在；随铜靶功率的增加,铜的晶粒尺寸先变大后变小；随钨靶功率的增大,β-钨有向非晶态转变的趋势,且铜的晶粒尺寸会明显变小；薄膜的沉积速率主要由钨靶功率决定；工作气体氩气气压低于1.0 Pa时,随气压升高,铜的晶粒尺寸变小,高于1.0 Pa时,气压对薄膜结构没有影响.
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