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采用真空座滴法研究了基体表面粗糙度(Ra)对AgCu-4.3 at% Ti/ Al2O3和AgCu-4.3 at% Ti/石墨两个体系润湿性能的影响,其中Al2O3的Ra为256 ~ 636 nm,石墨的Ra为265~ 1898 nm.结果表明,基体粗糙度对界面反应层厚度及其侧向生长、润湿动力学和最终润湿角(θf)均有很大影响.在1200 K的润湿温度下,随着基体Ra的增加,两个润湿体系的最终润湿角均呈上升趋势;高温反应性润湿体系润湿性的好坏取决于界面反应产物的侧向生长,当基体表面粗糙度增加时,增加了金属液体中活性元素向产物侧向生长前沿扩散的距离,同时粗糙表面的轮廓峰会对三相线的移动产生钉扎作用,因此界面反应产物侧向生长受到抑制;活性元素更易于向界面处扩散,生成更厚的界面反应产物层;当活性金属液体在粗糙表面润湿时,具有相对缓慢的润湿速度,达到润湿平衡的时间也较短,最终导致较大的润湿角.

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