以不同环氧官能团数量的环氧树脂和不同添加量的固化剂为原料制备了导电胶,通过红外光谱、扫描电子显微镜等手段测试其结构和性能.结果表明,拉伸剪切强度随环氧官能团数目的增加而降低,其中双官能团的环氧树脂DER331所对应的树脂基体和导电胶的拉伸剪切强度最大,树脂基体为31MPa,导电胶为9MPa;随固化剂添加量的增加而增加,当环氧树脂和固化剂质量比为25∶7时,树脂基体为32MPa,导电胶为10MPa;与树脂基体的固化收缩率呈反比关系.
参考文献
[1] | Li Y;Moon KS;Wong CP .Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering[J].Journal of Applied Polymer Science,2006(4):1665-1673. |
[2] | Li Y.;Moon K.-S.;Whitman A.;Wong C. P. .Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2006(0):758-763. |
[3] | Yim L Y;Moon M J;Zhang K.Development of novel,flexible,electrically conductive adhesives for nextgeneration microelectronics interconnect applications[A].Lake Buena Vista,USA:Institute of Electrical and Electronics Engineers,2008:1272-1276. |
[4] | Li Y;Wong CP .Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications[J].Materials Science & Engineering, R. Reports: A Review Journal,2006(1/3):1-35. |
[5] | Irfan Mir;D. Kumar .Recent advances in isotropic conductive adhesives for electronics packaging applications[J].International Journal of Adhesion & Adhesives,2008(7):362-371. |
[6] | Lin YC;Zhong J .A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications[J].Journal of Materials Science,2008(9):3072-3093. |
[7] | Zwolinski M.;Hickman J. .Electrically conductive adhesives for surface mount solder replacement[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology.Part C.Manufacturing,1996(4):241-250. |
[8] | Liong S;Wong C P;Burgoyne Jr W F .Adhesion improvement of thermoplastic isotropically conductive adhesive[J].IEEE Transactions on Components Packaging and Manufacturing Technology,2005,28(02):327-336. |
[9] | Tan F;Qiao X;Chen J et al.Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives[J].International Journal of Adhesion and Adhesives,2006,26(06):406-413. |
[10] | 梁彤祥;王娟;闫迎辉 等.一种高连接强度的热固化导电胶[P].中国专利:CN1546591,2004-11-17. |
[11] | Zhao H;Liang T;Liu B .Synthesis and properties of copper conductive adhesives modified by SiO2 nanoparticles[J].International Journal of Adhesion and Adhesives,2007,27(06):429-433. |
[12] | H.P. Wu;X.J. Wu;M.Y. Ge;G.Q. Zhang;Y.W. Wang;Jianzhong Jiang .Properties investigation on isotropical conductive adhesives filled with silver coated carbon nanotubes[J].Composites science and technology,2007(6):1182-1186. |
[13] | LI Zhi-hua,KE Yu-peng,REN Dong-yan,ZHENG Zi-qiao.Structural characteristics and properties of PU-modified TDE-85/MeTHPA epoxy resin[J].中南工业大学学报(英文版),2007(06):753-758. |
[14] | 杨小峰.CLD-20结构型导电胶的研制及应用[J].中国胶粘剂,1999(02):39-41. |
[15] | 柯于鹏 .微电子组装用高性能银粉导电胶研究[D].中南大学,2008. |
[16] | 李志红 .环保型铜粉导电胶的研制[D].江西理工大学,2010. |
[17] | 李芝华,孙健.固化过程对导电胶体积电阻率的影响[J].高分子材料科学与工程,2010(08):80-82,86. |
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