采用高纯、高速N2(99.999%)流作为介质淬火处理在真空下固溶的粉末冶金Cu-Zr合金,然后时效处理.用HV、HB、XRD、TEM、SEM、EDS等来表征不同状态下的合金组织性能.结果表明:随着固溶时间的增加,合金的布氏硬度(HB)和导电率减小,而显微硬度(HV)增加:铜锆合金时效析出Cu2Zr,时效处理时间小于12 h时,合金的HB和导电率增加而HV减小,时效处理时间大于12 h时,合金的HB和HV减小而导电率增加,沉淀相长大.
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