欢迎登录材料期刊网

材料期刊网

高级检索

铜铝双金属复合材料由于其优良的综合性能受到广泛关注和研究.介绍了铜铝双金属复合材料的发展概况,综述了复合技术、界面行为、金属间化合物的形成和生长规律、金属间化合物的微观结构以及铜铝间的扩散行为等方面内容,论述了铜铝复合材料的力学和电学性能的研究进展,并提出了其发展趋势.

参考文献

[1] Veerkamp W E.Copper-to-aluminum transitions in high direct-current bus systems[A].Denver,CO,1995:187.
[2] Braunovic M. .Evaluation of different platings for aluminum-to-copper connections[J].IEEE transactions on components, hybrids, and manufacturing technology,1992(2):204-215.
[3] Braunovic M. .Evaluation of different contact aid compounds for aluminum-to-copper connections[J].IEEE transactions on components, hybrids, and manufacturing technology,1992(2):216-224.
[4] Braunovic M;Alexandrov N .Intermetallic compound at aluminum-to-copper electrical interface-effect of temperature and electric-current[J].IEEE Trans Components Packaging Manuf Techn Part A,1994,17(01):78.
[5] Abbasi M;Karimi Taheri A;Salehi M T .Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process[J].Journal of Alloys and Compounds,2001,319(1-2):233.
[6] Honarpisheh M;Asemabadi M;Sedighi M .Investigation of annealing treament on the interfacial properties of explosivewelded Al/Cu/Al multilayer[J].Materials and Design,2012,37:122.
[7] Fehim Findik .Recent developments in explosive welding[J].Materials & design,2011(3):1081-1093.
[8] Guo, Y.;Qiao, G.;Jian, W.;Zhi, X. .Microstructure and tensile behavior of Cu-Al multi-layered composites prepared by plasma activated sintering[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2010(20):5234-5240.
[9] 郭亚杰,刘桂武,金海云,史忠旗,乔冠军.Cu和Al箔扩散结合界面相生长行为研究[J].稀有金属材料与工程,2012(02):281-284.
[10] Xue, P.;Ni, D.R.;Wang, D.;Xiao, B.L.;Ma, Z.Y. .Effect of friction stir welding parameters on the microstructure and mechanical properties of the dissimilar Al-Cu joints[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2011(13/14):4683-4689.
[11] Xue, P.;Xiao, B.L.;Ni, D.R.;Ma, Z.Y. .Enhanced mechanical properties of friction stir welded dissimilar Al-Cu joint by intermetallic compounds[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2010(21/22):5723-5727.
[12] Galvao V;Loureiro A;Verdera D et al.Influence of tool offsetteng on the structure and morphology of dissimilar aluminum ro copper friction-stir welds[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,2012,43:5096.
[13] Xue P;Xiao B L;Wang D et al.Achieving high property friction stir welded aluminum/copper lap joint at low heat input[J].Sci Techn Weld Joining,2011,16(08):657.
[14] R. Heideman;C. Johnson;S. Kou .Metallurgical analysis of Al/Cu friction stir spot welding[J].Science and Technology of Welding and Joining,2010(7):597-604.
[15] Jiunn Chen;Yi-Shao Lai;Yi-Wun Wang;C.R. Kao .Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding[J].Microelectronics and reliability,2011(1):125-129.
[16] Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging[J].Microelectronics and reliability,2008(3):416.
[17] Drozdov M;Gur G;Atzmon Z;Kaplan WD .Detailed investigation of ultrasonic Al-Cu wire-bonds: I. Intermetallic formation in the as-bonded state[J].Journal of Materials Science,2008(18):6029-6037.
[18] Drozdov M;Gur G;Atzmon Z;Kaplan WD .Detailed investigation of ultrasonic Al-Cu wire-bonds: II. Microstructural evolution during annealing[J].Journal of Materials Science,2008(18):6038-6048.
[19] Chih-Chun Hsieh;Ming-Shou Shi;Weite Wu .Growth of Intermetallic Phases in Al/Cu Composites at Various Annealing Temperatures During the ARB Process[J].Metals and Materials International,2012(1):1-6.
[20] Eizadjou M;Talachi A K;Manesh H D et al.Investigation of structure and mechanical properties of multi-layered Al/Cu composite produced by accumulative roll bonding (ARB)process[J].Composites Science and Technology,2008,68:2003.
[21] Li, X.;Zu, G.;Wang, P..Interface strengthening of laminated composite produced by asymmetrical roll bonding[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2013:96-100.
[22] Alizadeh, M.;Talebian, M..Fabrication of Al/Cu _p composite by accumulative roll bonding process and investigation of mechanical properties[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2012:331-337.
[23] Xia CZ;Li YJ;Puchkov UA;Gerasimov SA;Wang J .Microstructure and phase constitution near the interface of Cu/Al vacuum brazing using Al-Si filler metal[J].Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology,2008(8):799-804.
[24] Bersk S;Dyja H;Maranda A et al.Analysis of quality of bimetallic rod after extrusion process[J].J Mater Process Techn,2006,177(1-3):582.
[25] Lee T H;Lee Y J;Park K J et al.Controlling Al/Cu composite diffusion layer during hydrostatic extrusion by using colloidal Ag[J].J Mater Process Techn,2013,213:487.
[26] 赵鸿金,王达,秦镜,张迎晖.铜/铝层状复合材料结合机理与界面反应研究进展[J].热加工工艺,2011(10):84-87.
[27] 黄宏军,张泽伟,王书生,袁晓光.铜铝薄板轧制复合工艺[J].沈阳工业大学学报,2009(05):531-535.
[28] Pfeifer S;Grobmann S;Freudenberger R.Characterization of intermetallic compounds in Al-Cu-bimetallic interfaces[A].Portland,OR,2012:1.
[29] 张红安,陈刚.铜/铝复合材料的固-液复合法制备及其界面结合机理[J].中国有色金属学报,2008(03):414-420.
[30] Tanaka Y;Kajihara M;Watanabe Y .Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al[J].Mater Sei Eng A,2007,445:355.
[31] 廖文俊,刘新宽,王宇鑫.高性能铜/铝复合排的制备及界面机理[J].同济大学学报(自然科学版),2012(08):1234-1238.
[32] Xu B;Tong W P;Liu C Z et al.Effect of high magnetic field on growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al[J].Journal of Materials Science and Technology,2011,27(09):856.
[33] Liu X;Cui J;Yu F .Effect of an alternating magnetic field on the phase formation in Al-Cu couple[J].Journal of Materials Science,2004,39(08):2935.
[34] Le H R;Sutcliffe M P F;Wang P Z et al.Surface oxide fracture in cold aluminum rolling[J].ACTA MATERIALIA,2004,52(04):911.
[35] Furmidge J E;Howd D;Tylecote R F .The influence of surface films on the pressure welding of metals[J].British Weld J,1958,5(01):21.
[36] 刘耀辉,刘海峰,于思荣.液固结合双金属复合材料界面研究[J].机械工程学报,2000(07):81-85.
[37] 吴振卿,关绍康,刘清梅,吴知非.镶铸复合铸造工艺中镶块体积的计算[J].铸造设备研究,2002(03):5-6.
[38] Mohamed H A;Washburn J.Mechanism of solid state pressure welding[J].Welding Journal,1971(09):302.
[39] Vaidynath L R;Nicholas M G;Milner D R .Pressure welding by rolling[J].British Weld J,1959,6:13.
[40] Granjon H.Fundamentals of welding metallurgy[M].Cambridge,UK:Abington Publishing,1991
[41] Parks J.Reerystallization in welding[J].Welding Journal,1953(34):209.
[42] Milner D R;Vaidynath L R .Significance of surface preparation in cold cold pressure welding[J].British Weld J,1960,7:1.
[43] Chih-Yuan Chen;Hao-Long Chen;Weng-Sing Hwang .Influence of Interfacial Structure Development on the Fracture Mechanism and Bond Strength of Aluminum/Copper Bimetal Plate[J].Materials transactions,2006(4):1232-1239.
[44] Murray J L .The aluminium-copper system[J].International Metals Reviews,1985,30(01):211.
[45] Chih-Yuan Chen;Weng-Sing Hwang .Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints[J].Materials transactions,2007(7):1938-1947.
[46] Heness G;Wuhrer R;Yeung WY .Interfacial strength development of roll-bonded aluminium/copper metal laminates[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2008(0):740-742.
[47] Jiang H G;Dai J Y;Tong H Y et al.Interfacial reactions on annealing Cu/Al multilayer thin films[J].Journal of Applied Physics,1993,74(10):6165.
[48] LY. Sheng;F. Yang;T.F. Xi;C. Lai;H.Q, Ye .Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling[J].Composites, Part B. Engineering,2011(6):1468-1473.
[49] 顾文桂.铜铝固相轧制复合的界面组成[J].中国有色金属学报,1996(01):79-83.
[50] Wulff F W;Breach C D;Stephan D.Characterisation of intermetallic growth in copper and gold ball bonds on aluminium metallization[A].,2004:348.
[51] Paxton AT. .ATOMIC STRUCTURE OF METALLIC INTERFACES[J].Journal of Physics, D. Applied Physics: A Europhysics Journal,1996(7):1689-1698.
[52] A. E. Romanov;T. Wagner;M. Ruhle .Coherent to incoherent transition in mismatched interfaces[J].Scripta materialia,1998(6):869-875.
[53] Pelzer R;Nelhiebel M;Zink R et al.High temperature storage reliability investigation of the Al-Cu wire bond interface[J].Microelectronics Reliability,2012,52:1966.
[54] X. K. PENG;R. WUHRER;G. HENESS .Rolling strain effects on the interlaminar properties of roll bonded copper/aluminium metal laminates[J].Journal of Materials Science,2000(17):4357-4363.
[55] Shabani A;Toroghinejad M R;Shafyei A .Effect of postrolling annealing treatment and thickness of nickel coating on the bond strength of Al-Cu strips in cold roll bonding process[J].Materials and Design,2012,40:212.
[56] Lee W B;Bang K S;Jung S B .Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing[J].Journal of Alloys and Compounds,2005,390(1-2):212.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%