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通过对氧化石墨热膨胀还原并用超声分散制备了石墨烯,并对所得产物进行分析表征。用超声分散和模具浇注成型法制备了石墨烯/环氧树脂纳米复合材料。研究了石墨烯含量对石墨烯/环氧树脂复合材料力学性能和断面形貌的影响,分析了石墨烯对环氧树脂的增强机理。结果表明,随着石墨烯含量的增加,石墨烯/环氧树脂复合材料的拉伸强度及模量先增加后减小;当石墨烯的质量分数为0.1%时,复合材料的拉伸强度达到最大值60.9MPa,比纯环氧树脂提高了16.88%;当石墨烯的质量分数为0.5%时,复合材料的拉伸模量达到最大值2833.3MPa,比纯环氧树脂提高了48.29%。

Graphene /epoxy nanocomposites were prepared using ultrasonication and the cast molding method.Graphene was well dispersed in an epoxy matrix.The effects of graphene addition and surface modification on the mechanical properties and fracture morphologies of composites were investigated.The results indicate that the tensile and modulus of the graphene/epoxy composites increase firstly and then decrease with the increase of graphene addition,and when the content of graphene loading reaches 0.1%,the tensile strength reaches the highest value of 60.9 MPa,which is increased by 16.88%.When the content of graphene loading reaches 0.5%,the tensile modulus of the graphene/epoxy composites reaches the highest value of 2833.3 MPa,which is increased by 48.29%.The reinforcement mechanisms of the graphene/epoxy composites were discussed according to the fracture morphologies of composites.

参考文献

[1] Geim AK;Novoselov KS .The rise of graphene[J].Nature materials,2007(3):183-191.
[2] Haiqun Chen;Marc B. Mueller;Kerry J. Gilmore;Gordon G. Wallace;Dan Li .Mechanically Strong, Electrically Conductive, and Biocompatible Graphene Paper[J].Advanced Materials,2008(18):3557-3561.
[3] Guohua Chen;Wengui Weng;Dajun Wu .Preparation and characterization of graphite nanosheets from ultrasonic powdering technique[J].Carbon: An International Journal Sponsored by the American Carbon Society,2004(4):753-759.
[4] Yasmin A;Daniel IM .Mechanical and thermal properties of graphite platelet/epoxy composites[J].Polymer: The International Journal for the Science and Technology of Polymers,2004(24):8211-8219.
[5] Yu AP;Ramesh P;Itkis ME;Bekyarova E;Haddon RC .Graphite nanoplatelet-epoxy composite thermal interface materials[J].The journal of physical chemistry, C. Nanomaterials and interfaces,2007(21):7565-7569.
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