提高临界电流密度(J_c)对促进Bi-2223/Ag高温超导带材的应用有着重要意义.在常压热处理条件下所制备的带材中存在大量的裂纹、孔洞和第二相颗粒等,这些因素都会对带材的超导连接性能产生破坏作用.我们成功建立了一套可用氧气氛的热等静压设备,工作气压和温度可同时达到15 MPa和850℃.通过引入裂纹愈合热处理过程,我们成功对带材进行了高压热处理,所得样品中第二相颗粒和裂纹数量大幅度降低,77 K、自场下的临界电流相比常压热处理样品提高了20%左右.
It is essential to improve the critical current density of Bi-2223/Ag superconducting tapes for its widescale applications. However, there are plenty of cracks, holes and secondary particles remained in tapes after normal pressure heat treatments, which are great obstacles for the superconducting connectivity. To solve this problem, we built a HIP system which can work under oxygen atmosphere. Its working pressure and temperature can reach 15 MPa and 850℃ simultaneously. By introducing the Crack Healing Process (CHP), we successfully applied HIP on Bi-2223/Ag tapes. The amount of cracks and holes was greatly suppressed. The critical current at 77 K was improved by more than 20%, compared with that of the normal pressure heat treatment.
参考文献
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