传统封装材料的性能已经不能满足微电子技术飞速发展的需要.为此,国内外相继采用喷射成形技术研究开发了适用于电子行业发展的新型Si-Al系列合金.这种高硅(50～70wt%)合金具有细小均匀的显微组织,以及均匀和各向同性的性能,同时具有低热膨胀系数、高热导率和低密度等特点.与普通碳化硅增强金属基复合材料(MMCs)不同,新合金可以用普通刀具进行加工,并且容易进行镀镍、铜、银和金等涂覆处理.采用上述材料已成功地制备了航空应用的微波放大器模块,比全可伐合金封装减重约30%以上.对喷射成形Si-Al合金的研究开发现状进行了简单评述.
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