以Al/Cu, Al/Si接触反应偶为例, 研究了不同基体与反应材料组合下, 共晶液相的产生及其铺展行为. 结果表明: Al/Cu, Al/Si接触反应偶中共晶液相的产生具有明显的方向性-优先在Al侧产生, 这是扩散偶之间的互扩散系数不等所造成的必然结果. 而在接触反应钎焊的中间层材料选择过程中, 考虑接触反应液相产生的方向性是发挥接触反应钎焊优越性的保障.
参考文献
| [1] | Frolov I A .Contact reactive brazing of copper to steel via a manganese interlayer[J].Welding Production,1972,19(10):28-31. |
| [2] | Kruchinin V P;Metelkin I I .Contact reactive brazing of ceramics to metal[J].Welding Production,1972,19(12):68-73. |
| [3] | 陈定华;钱乙余;李严 .钎焊填缝机理的研究—不等间隙钎焊时钎料填缝过程研究[J].焊接学报,1981,2(01):1-8. |
| [4] | Jacobson D M;Umpston G H.Diffusion solder[J].Soldering and Surface Mount Technology,1992(10):27-32. |
| [5] | Takehiko W;Hiyasa S .Eutectic bonding of Al pipe to Cu pipe[J].Journal of the Japan Welding Society,1998,16(01):35-44. |
| [6] | Jankowski A F;Hayes J P .Eutectic bonding of a Ti sputter coated carbon aerogel wafer to an Ni foil[J].Surface and Coatings Technology,1994,12:68-69. |
| [7] | Wu Y C .Eutectic bonding of nickel to yttria-stabilized zirconia[J].Journal of Materials Science Letters,1990,9(05):583-586. |
| [8] | Ferro C;Derby B .Liquid phase bonding of siliconized silicon car bide[J].Journal of Materials Science,1995,30(12):6119-6135. |
| [9] | Gale W F;Wen X;Shen Y.Diffusion brazing of Titanium Aluminide- wettability,microstructural development,and mechanical properties[A].Albuquerque,New Mexico,2000:42-49. |
| [10] | Niemann J T;Garrett R A .Eutectic bonding of Boron-Alumi num structural components: part 1-evaluation of critical processing parameters[J].Welding Journal,1974,53(04):175S-184S. |
| [11] | Niemann J T;Garrett R A .Eutectic bonding of Boron-Aluminum st ructural components: part 2 - development and application of the process[J].Welding Journal,1974,53(08):351s-360s. |
| [12] | 陈定华;钱乙余;黄继华 .Al/Cu接触反应钎焊中反应铺展现象和氧化膜行为[J].金属学报,1989,25(01):B42-B47. |
| [13] | QIAN Yi-yu,DONG Zhan-gui,MA Xin.Penetrating behavior of eutectic liquid during |
| [14] | 卡扎柯夫 H Ф;何康生.真空扩散焊接[M].北京:国防工业出版社,1976:9-12. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%