利用XRD、SEM及EDAX研究了钎焊和时效过程中低银Sn-2.5Ag-0.7Cu(0.1RE)/Cu焊点界面区显微组织和Cu_6Sn_5金属间化合物的生长行为.结果表明,钎焊过程中焊点界面区Cu_6Sn_5金属间化合物的厚度是溶解和生长两方面共同作用的结果;随时效时间的增加,焊点界面区Cu_6Sn_5的形貌由扇贝状转变为层状,其长大动力学符合抛物线规律,由扩散机制控制;添加0.1%(质量分数,下同)的RE能有效减慢界面Cu_6Sn_5金属间化合物在钎焊及时效过程中的长大速度,改变焊点的断裂机制,提高其可靠性.
The microstructure of low-Ag-content Sn-2.5Ag-0.7Cu(0.1RE)/Cu solder joint interface and growth behavior of Cu_6Sn_5 intermetallic compound (IMC) were investigated by XRD, SEM and EDAX. The results show that the Cu_6Sn_5 thickness of the solder joint interface is decided by its dissolution and growing during soldering. With the aging time increasing, the Cu_6Sn_5 morphology of the solder joint interface changed from scallop-like to lamellar; the growth dynamics follows the parabola law and its growth behavior is controlled by diffusion mechanism. Addition of 0.1% RE (mass fraction) in the Sn-2.5Ag-0.7Cu solder alloy can effectively reduce the growing rate of the solder joint Cu_6Sn_5 IMC during the soldering and aging period, and change the fracture mechanism of solder joint; therefore the reliability of the solder joint can be greatly improved.
参考文献
| [1] | 张柯柯,王要利,樊艳丽,祝要民,张鑫,阎焉服.RE含量及环境条件对SnAgCu钎焊接头蠕变断裂寿命的影响[J].稀有金属材料与工程,2007(08):1473-1476. |
| [2] | 樊艳丽,张柯柯,王双其,程光辉,王要利,余阳春.水洗钎剂下SnAgCu系钎料对不同基板的润湿特性[J].特种铸造及有色合金,2006(09):604-606. |
| [3] | 许天旱,赵麦群,刘新华.Sn-Ag-Cu系无铅焊锡成分的优化研究[J].电子元件与材料,2004(08):14-16,21. |
| [4] | 张柯柯,王双其,余阳春,王要利,樊艳丽,程光辉,韩丽娟.SnAgCuRE系无铅钎料与表面贴装元器件的润湿适配性[J].中国有色金属学报,2006(11):1908-1912. |
| [5] | YAN Yanfu,FENG Lifang,ZHANG Keke,WEN Jiuba.Influence of Temperature on Creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder[J].清华大学学报(英文版),2007(03):296-301. |
| [6] | Ahat S;杜黎光;孙志国 et al.[J].金属学报,2001,37(04):439. |
| [7] | Guo F;Lucas J P;Subramanlian K N .[J].Journal of Materials Science,2001,12:27. |
| [8] | Song H G;Morris J W;Hua F .[J].Journal of Minerals Metals and Materials,2002,6:30. |
| [9] | 王廷惠 et al.2005年第6届国际电子封装技术会议[R].Shenzhen:China Electronics Packing Society,2005. |
| [10] | Suganuma K;宁晓山.无铅焊接技术[M].北京:科学出版社,2004:62. |
| [11] | Yoon JW;Jung SB .Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate[J].Journal of Materials Science,2004(13):4211-4217. |
| [12] | Vianco P T;Rejent J A;Hlava P F .[J].Journal of Electronic Materials,2004,33(09):990. |
| [13] | Zhang Keke;Wang Yaoli;Fan Yanli.[J].Key Engineering Materials,2007(353-358):2912. |
| [14] | 王烨,黄继华,张建纲,齐丽华.Sn-3.5Ag-0.5Cu/Cu界面的显微结构[J].中国有色金属学报,2006(03):495-499. |
| [15] | Kim K S;Huh S H;Suganuma K .[J].Journal of Alloys and Compounds,2003,352:226. |
| [16] | 岳译新,谭澄宇,郑子樵,李世晨,叶建军.新型Ag-Cu-Ge钎料的性能及钎焊界面特征[J].中国有色金属学报,2006(10):1793-1798. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%