采用真空热压法制备了不同配比的SiC/Cu金属陶瓷复合材料.利用阿基米德原理测定了复合材料的密度及气孔率;利用Instron万能材料电子试验机测得其三点弯曲强度;采用Hv-1000显微硬度仪测试其显微硬度,采用X射线衍射仪(XRD)和扫描电子显微镜(SEM)对烧成样品的物相组成和断口显微形貌进行表征.结果表明:随着SiC组分含量的增加,SiC/Cu复合材料的致密度、抗弯强度均有所下降,而气孔率和显微硬度显著增加.在750 ℃,30 MPa压力作用下,保温3 min,制备得到的30SiC/70Cu(vol%)的复合材料,具有最优的力学性能,其显微硬度达到2087.2 MPa,抗弯强度为174.0 MPa.SiC/Cu复合材料的断裂行为既表现出一定的微观韧性特征,又表现出一定的脆性特征.
参考文献
| [1] | Martinez V.;Ordonez S.;Castro F.;Olivares L.;Marin J. .Wetting of silicon carbide by copper alloys[J].Journal of Materials Science,2003(19):4047-4054. |
| [2] | Kock T;Brendel A;Bolt H .Interface reactions between silicon carbide and interlayers in silicon carbide-copper metal-matrix composites[J].Journal of Nuclear Materials: Materials Aspects of Fission and Fusion,2007(2/3):197-201. |
| [3] | Zhu J H;Liu L;Shen B .Mechanical properties of Cu/SiCp composites fabricated by composite electroforming[J].Materials Letters,2007,61:2804-2809. |
| [4] | Sundberg G;Paul P;Sung CM;Vasilos T .Fabrication of CuSiC metal matrix composites[J].Journal of Materials Science,2006(2):485-504. |
| [5] | Zhu J H;Liu L;Shen B et al.Mechanical properties of Cu/SiCp composites fabricated by composite electroforming[J].Materials Letters,2007,61:2804-2809. |
| [6] | Rui Zhang;Lian Gao;Jingkun Guo .Thermodynamic Behavior of Copper-Coated Silicon Carbide Particles during Conventional Heating and Spark Plasma Sintering[J].Journal of the American Ceramic Society,2003(8):1446-1448. |
| [7] | 梁训裕;刘景林.碳化硅耐火材料[M].北京:冶金工业出版社,1981 |
| [8] | Zhang R.;Gao L.;Guo JK. .Temperature-sensitivity of coating copper on sub-micron silicon carbide particles by electroless deposition in a rotation flask[J].Surface & Coatings Technology,2003(1):67-71. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%