可靠性是电子工业发展所面临的最大难题.随着对无铅焊料的深入研究,消除金属间化合物对焊点机械性能的不利影响,及解决由于印刷电路板与电子材料间的热膨胀系数不同所产生的、在热循环过程中出现的热疲劳现象,都是提高可靠性的途径.提出了开发自适应无铅焊料解决上述问题,阐述了制备自适应无铅焊料的可行性,并展望了此种焊料的良好应用前景.
参考文献
| [1] | 沈骏,刘永长,张培珍,高后秀.无铅焊料研究现状与发展展望[J].功能材料,2004(04):403-406. |
| [2] | Zeng K.;Tu KN. .Six cases of reliability study of Pb-free solder joints in electronic packaging technology [Review][J].Materials Science & Engineering, R. Reports: A Review Journal,2002(2):55-105. |
| [3] | 柳春雷,金展鹏,刘华山.相图计算在电子材料焊接中的应用[J].中国有色金属学报,2003(06):1343-1349. |
| [4] | Kim K S;Huh S H;Suganuma K .Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints[J].Journal of Alloys and Compounds,2003,352(1-2):226. |
| [5] | Chang T C;Hon M H;Wang M C .Intermetallic compounds formed at the interface between Cu substrate and Sn-9Zn0.5Ag lead-free solder[J].Materials Research Bulletin,2003,38(05):909. |
| [6] | Lee H T;Chen M H;Jao H M et al.Influence of interfacial intermetallic compound on fracture behavior of Solder joints[J].Materials Science and Engineering A,2003,358(1-2):134. |
| [7] | Duan N;Scheer J;Bielen J et al.The influence of Sn-CuNi(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates[J].Microelectronics Reliability,2003,43:1317. |
| [8] | Alam M O;Chan Y C;Hung K C .Reliability study of the electroless Ni-P layer against solder alloy[J].Microelectronics Reliability,2002,42:1065. |
| [9] | Chang T C;Hon M H;Wang M C .Intermetallic compounds formation and interfacial adhesion strength of Sn9Zn-0.5Ag solder alloy hot-dipped on Cu substrate[J].Journal of Alloys and Compounds,2003,352:168. |
| [10] | Kim K S;YangJ M;Yu C H et al.Analysis on interfacial reactions between Sn-Zn solders and the Au/Ni electrolyticplated Cu pad[J].Journal of Alloys and Compounds,2004,379:314. |
| [11] | Ghosh G .Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints[J].Acta Materialia,2001,49:2609. |
| [12] | Microstructural effects on the behavior of Sn-Ag solder joints under repeated reverse stressing[J].Journal of Materials Science. Materials in Electronics,2003(3):157-164. |
| [13] | Chang TC.;Wang MC.;Hon MH. .Effect of aging on the growth of intermetallic compounds at the interface of Sn-9Zn-xAg/Cu substrates[J].Journal of Crystal Growth,2003(1/2):236-243. |
| [14] | Suganuma K;Nakamura Y .Microstructure and Strength of Interface between Sn-Ag Eutectic Solder and Cu[J].Journal of the Japan Institute of Metals,1995,59:1299. |
| [15] | Song J M;Lan G F;Lui T S et al.Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys[J].Scripta Materialia,2003,48:1047. |
| [16] | Plumbridge WJ. .SOLDERS IN ELECTRONICS [Review][J].Journal of Materials Science,1996(10):2501-2514. |
| [17] | Abtew M;Selvaduray G .Lead-free solders in microelectronics[J].Materials Science and Engineering A,2000,27:95. |
| [18] | 黄惠珍,魏秀琴,周浪.无铅焊料及其可靠性的研究进展[J].电子元件与材料,2003(04):39-42. |
| [19] | 赵连成;蔡伟;郑玉峰.合金的形状记忆效应与超弹性[M].北京:国防工业出版社,2002 |
| [20] | Fouassier O;Chazelas J;Silvain J F .Conception of a consumable copper reaction zone for a NiTi/SnAgCu composite material[J].Composites Part A:Applied Science and Manufacturing,2002,33:1391. |
| [21] | Silvain JF;Lahaye M;Trombert S;Chazelas J .Use of shape memory alloy NiTi particles in SnPbAg matrix: interfacial chemical analysis and mechanical characterisation[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,1999(0):818-823. |
| [22] | Dutta I;Majumdar B S;Pan D et al.Development of a novel adaptive lead-free solder containing reinforcements displaying the shape-memory effect[J].Journal of Electronic Materials,2004,33:258. |
| [23] | McDonald R D;Singleton J;Harrison N et al.Alphen spectra of the shape-memory alloy AuZn[J].Journal of Magnetism and Magnetic Materials,2004,272-276:1681. |
| [24] | Jason C.Lashley;Brian E.Lang;Juliana Boerio-Goates;Brian F.Woodfield .The heat capacity of single-crystal AuZn near the martensitic transition[J].The Journal of Chemical Thermodynamics,2002(2):251-261. |
| [25] | Takezawa K;Sato S;Minato K et al.Martensitic and bainitic transformations in Ag-Zn alloys[J].Materials Transactions,1992,33(03):294. |
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