采用无模板水热法,以四磺基酞菁铜(CuTSPc)敏化SnO2制备了CuTSPc/SnO2纳米介孔复合材料,通过X射线衍射、透射电镜、氮气吸附-脱附、紫外-可见光谱和傅里叶变换红外光谱等对复合材料进行了表征,并以罗丹明B (RhB)为目标降解物考察了其低功率(15 W光源)可见光光催化活性及循环使用性. 结果表明, CuTSPc周环的磺基与SnO2表面的锡离子形成双齿螯合, 0.1 mol% (CuTSPc与SnO2物质的量比) CuTSPc/SnO2复合材料的比表面积和平均孔径分别为236 m2/g和2.6 nm, 反应180 min时可见光降解率高达87%, 循环使用率较高(87%±5%).
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