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利用AlCl3+LiAlH4+MgBr2有机溶剂体系在碳钢基体上电沉积出Al-Mg合金镀层,并对不同沉积电流密度下Al-Mg镀层的表面形貌、成分、结构、厚度、结合力和耐蚀性进行了研究. 结果表明:沉积出的铝镁合金镀层表面光滑、均匀、致密;膜层中的镁含量随沉积电流密度的增加而增大,且以Al-Mg固溶体形式存在,并按(200)面的结构生长;随沉积电流密度的增加,铝镁合金镀层的厚度与晶格常数呈线性增大;在3.5%NaCl溶液中的耐蚀性呈先增大后减小的规律;Al-Mg镀层与碳钢基体的结合力良好,均大于50N;Al-Mg镀层的沉积速率、结合力和耐蚀性均高于相同沉积条件下的纯铝镀层;Al-Mg合金镀层沉积的最佳电流密度为0.75~1.50A/dm2.

参考文献

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