采用溶胶-凝胶法结合匀胶旋涂工艺在复合基片(Pt/Ti/SiO2/Si)上制备了钴铁氧体(CoFe2O4)薄膜,利用XRD、SEM、VSM分析了薄膜的微结构以及磁性能,研究了不同退火温度对钴铁氧体薄膜的结构和磁性能的影响.结果表明,钴铁氧体在500℃时开始形成尖晶石相.随着退火温度的增高,钴铁氧体晶粒逐渐长大,饱和磁化强度和矫顽力逐渐增强,到600℃时,尖晶石相已经非常明显,晶粒尺寸大小均一,饱和磁化强度和矫顽力分别为427.48 emu·cm-3和1224.11Oe,当退火温度提高到700℃时,晶粒进一步长大,但是薄膜中出现反铁磁相α-Fe2O3,而且薄膜表面出现了气孔和晶粒大小不均匀等缺陷,导致饱和磁化强度和矫顽力下降.
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