运用弹塑性有限元方法的平面应变分析模型,依据引线框架Cu-Fe-P合金精轧后表面起皮剥落处的显微组织特征,研究了Cu基体和Fe相颗粒界面附近的应力应变场分布.研究表明:铜基体与铁相的塑性行为及应力应变分布具有明显的不均匀性,界面区强烈的应力集中易造成界面开裂;精轧前Fe相周围的微裂纹在精轧变形时将进一步发展,直至发生引线框架板材表面起皮剥落破坏.应避免热轧板坯中出现较大Fe颗粒.
参考文献
[1] | 曹育文 .引线框架用高强度高导电铜合金研究[D].清华大学,1999. |
[2] | Zhao DM.;Dong QM.;Liu P.;Kang BX.;Huang JL.;Jin ZH. .Structure and strength of the age hardened Cu-Ni-Si alloy[J].Materials Chemistry and Physics,2003(1):81-86. |
[3] | 苏娟华,董企铭,刘平,李贺军,康布熙.Simulation of aging process of lead frame copper alloy by an artificial neural network[J].中国有色金属学会会刊(英文版),2003(06):1419-1423. |
[4] | Ryu H J;Baik H K .[J].Journal of Materials Science,2000,35:3641-3646. |
[5] | Choi H I .[J].Journal of Materials Science Letters,1997,16:1600-1602. |
[6] | Huang F X;Ma J S .[J].Alloy Scripta Materialia,2003,48:97-102. |
[7] | Landis C M;Beyerlein I J;Mcmeeking R M .[J].Journal of the Mechanics and Physics of Solids,2000,48:621-648. |
[8] | GonzaAlez C .[J].Journal of the Mechanics and Physics of Solids,2000,48:675-692. |
[9] | Li Y;Ramesh K T;Chin E S C .[J].Acta Materialia,2000,48:1563-1573. |
[10] | Soppa E .[J].Computational Materials Science,2003,28:574-586. |
[11] | Wang J C;Yang G C .[J].COMPUTATIONAL MATERIALS SCIENCE,2001,21:9-16. |
[12] | Gall Ken .[J].Mechanics of Materials,2000,32:277-301. |
[13] | Gall Ken .[J].Journal of the Mechanics and Physics of Solids,2000,48:2183-2212. |
[14] | 束德林.金属力学性能[M].北京:机械工业出版社,2001:90. |
[15] | 雷明凯,罗鹏,高峰,袁力江.钢渗硼表面残余应力的数值分析[J].金属学报,2002(01):47-52. |
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