采用电化学机械处理加有机溶液保护膜的表面处理方法,在Gleeble 1500试验机上进行了超塑状态LC4 Al合金的扩散焊接。焊接工艺条件为:温度490—530℃,压力1.0—3.0MPa,时间30—180min,真空度1×10~(-3)Pa。获得了与基体一致的接头强度和接头显微组织。讨论了合金的超塑处理对焊接过程的影响,提出超塑状态下扩散焊接的微观机制为原子扩散和晶粒生长造成的原始界面的迁移。作为比较,文中还给出了该合金淬火时效状态试样的焊接结果。
Diffusion bonding of superplastic LC4 AI alloy, with prior surface treatment of organic solution protecting coating Sfter electropolishing and stainless steel wool brushing, was performed by Gleeble test machine under conditions ranged 490—530℃, 1.0 —3.0 MPa, 30—180 min and vacuum of 1.0×10~-3 Pa. The joints were examined to have similar strength and microstructure to the base metal. Discussion was made on the effect of superplastic treatment on bonding. The micromechanism for diffusion bonding of superplastic metal was suggested as the migration of original bond interfaces caused by atomic diffusion and grain growth. Experimental results for the alloy as quench-aged state were presented to compare with the superplastic one.
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