就Sn-Ag、Sn-Cu、Sn-Ag—Cu和Sn—Zn几种主要的无铅焊料合金系阐述了当前对无铅焊料腐蚀性能的研究情况。指出当前研究只关注了焊料本体的腐蚀性能，而在焊接过程中焊料熔化和凝固后的微观结构和化学等将发生变化，这些对腐蚀有很大影响。提出进一步研究应关注实际焊点与服役环境的交互作用机制。
Corrosion performance of Sn-Ag, Sn-Cu, Sn-Ag-Cu and Sn-Zn lead-free solders are examined in this paper. The previous investigations were only focused on the solder itself, however, during the soldering process the solder was melted and then solidified. Compared to original solder material, the microstructure and chemistry of the solidified solder may change, which will affect the corrosion behavior of the solder during service in aggressive environment. So the investigation in the future should focus on the corrosion behavior of the solder joint used in aggressive environment.
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