采用“双粉法”制备Bi-2223/Ag带材，通过对2212和CaCuO2的不同配比研究，确定了双粉法中CaCuO2的最佳含量。实验结果表明：当前驱粉中CaCuO2相过量5%时，带材的临界电流密度比CaCuO2无过量时高10%左右。这主要是因为在反应过程中，过量的CaCuO2会提供较丰富的液相，促使2212→2223转变过程进行得更彻底，且转变速度提高；但过量值较大(10%～15%)时，过多的液相会导致杂相的偏聚，大尺寸的杂相粒子使其周围的2223相织构度降低，晶粒连接性较差，带材的临界电流密度下降。
CaCuO2 content has been optimized for two-powder process. Theexperimental results indicate that as precursor powders have 5% exces sive CaCuO2, the critical current density of tape increases about 10%. During the reaction process, excessive CaCuO2 afford enough liquid phase which accele rate the 2223 phase formation, but too much CaCuO2 (＞15%) will produce impure phases at grain boundary. Large impurity particles decrease the texture degree of the 2223 phase and critical current density of the tape.
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