为了制备不同锡含量的Ni-Sn-P化学镀层并研究其性能,利用X射线荧光光谱等分析了主盐、还原剂、配位剂浓度对镀层锡含量的影响,考察了热处理前后锡含量对镀层耐蚀性和显微硬度的影响.结果表明:镀液中氯化锡浓度在20～40 g/L时,随着其浓度的提高,镀层中锡含量增加,继续增加其浓度时,镀层中锡含量下降;提高柠檬酸三钠和乳酸的浓度有利于锡的沉积,而提高酒石酸钾钠、次磷酸钠的浓度对锡含量的增加不利;热处理后,镀层的腐蚀速率和孔隙率提高;锡含量提高时,镀态镀层和热处理镀层的腐蚀速率和孔隙率显著下降;锡含量在2.5%～12.1%时,镀层热处理前后的显微硬度均在550～650 HV之间,且随着锡含量的增加,镀层硬度增加;镀态镀层热处理后,显微硬度有小幅提高.
Electroless Ni-Sn-P coatings with different contents of tin were prepared. The effect of the concentration of main salts, reducing agents and complexing agents in bath on Sn content in the coatings was investigated by means of X-ray fluorescence spectrometry. At the same time, the effect of Sn content on the corrosion resistance and microhardness of the coatings before and after heat-treatment was studied. Results show that the content of Sn in the coatings increases with increasing concentration of SnCl_4 in bath within a range of 20～40 g/L. Above 40 g/L of SnCl_4 in the plating bath, the content of Sn in the coatings decreased with increasing concentration of SnCl_4. Besides, the deposition of Sn was promoted along with increasing concentration of sodium citrate and lactic acid, but increasing concentration of potassium sodium tartrate and sodium hypophosphite caused the decrease of Sn content in the coatings. At the same time, the porosity and corrosion rate of the alloy coatings significantly decreased along with increasing tin content. Moreover, heat-treatment led to slightly increased mierohardness and corrosion rate plus porosity. In general, the microhardness of the coatings with 2.5%～12.1% Sn ( mass fraction) was within 550～650 HV_(0.5N), and it increased with increasing Sn content.
参考文献
| [1] | 王宏智,彭海波,陈君,王津生.化学镀Ni-Sn-P合金的研究进展[J].电镀与涂饰,2007(06):51-54. |
| [2] | Zhang WX;Jiang ZH;Li GY;Jiang Q;Lian JS .Electroless Ni-Sn-P coating on AZ91D magnesium alloy and its corrosion resistance[J].Surface & Coatings Technology,2008(12):2570-2576. |
| [3] | J.N. Balaraju;S. Millath Jahan;Anjana Jain .Structure and phase transformation behavior of electroless Ni-P alloys containing tin and tungsten[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2007(1/2):319-327. |
| [4] | 葛圣松,邵谦,孙宏飞,唐祥国.高锡化学镀Ni-Sn-P合金工艺[J].功能材料,2004(z1):3235-3237,3242. |
| [5] | 孙武,李宁,赵杰,苏晓霞.低温化学镀锡工艺条件对锡层厚度的影响[J].电镀与环保,2006(03):17-20. |
| [6] | Z.P. Xia;Y. Lin;Z.Q. Li .A new phase in Ni-Sn-P system and its property as an anode material for lithium-ion batteries[J].Materials Characterization,2008(9):1324-1328. |
| [7] | 林忠华,林琳,杜金辉,吕元振.镍-锡-磷三元合金镀层及其应用[J].石油化工腐蚀与防护,2005(06):51-54. |
| [8] | 林忠华,林琳,杜金辉.化学镀Ni-Sn-P合金镀层的研究与应用[J].电镀与涂饰,2005(07):8-12. |
| [9] | 李宁.化学镀实用技术[M].北京:化学工业出版社,2004:482-483. |
| [10] | Jinku Yu;Tianfu Jing;Jun Yang;Qun Li .Determination of activation energy for crystallizations in Ni-Sn-P amorphous alloys[J].Journal of Materials Processing Technology,2009(1):14-17. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%