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介绍了微电子工业的发展趋势和SiO2作为CMOS栅介质减薄所带来的问题,从而引出对高K材料的需求,简单介绍了作为栅极介质的各种高介电常数材料的性能的比较及制备高K薄膜的主要方法,总结了一些高K材料的研究现状,论述了目前有待进一步解决的问题,并展望了高K材料的发展趋势.

参考文献

[1] Melliar-Smith C M;Haggan D E;Troutman W W.Keysteps to the integrated circuits[J].Bell Labs Technical Journal,1997(02):15.
[2] 朱正涌.半导体集成电路[M].北京:清华大学出版社,2001
[3] Raymond Heald;Wang Ping.Variability in sub-100m SRAM designs.Semiconductor Industry Association(SIA)[M].The national technology roadmap for semiconductors,Austin,2001
[4] Dennard R;Aensslen F G.Design of ion-implanted MOSFET's with very small physical dimensions[J].IEEE Journal of Solid-State Circuits,1974(09):256.
[5] Lo S.-H.;Buchanan D.A. .Quantum-mechanical modeling of electron tunneling current from the inversion layer of ultra-thin-oxide nMOSFET's[J].IEEE Electron Device Letters,1997(5):209-211.
[6] Wilk GD.;Anthony JM.;Wallace RM. .High-kappa gate dielectrics: Current status and materials properties considerations [Review][J].Journal of Applied Physics,2001(10):5243-5275.
[7] Chatterjee A;Rodder M .Atransistor performance figure-of merit including the effect of gate resistance and its application to scaling to sub-0.25μm CMOS logic technologies[J].IEEE Transactions on Electron Devices,1998,45:1246.
[8] Muller D A;Sorsch T;Moccio S et al.The electronic structure at the atomic scale of ultrathin gate oxides[J].Nature,1999,399:758.
[9] Tang SP.;Seabaugh A.;King-Smith D.;Wallace RM. .Evaluating the minimum thickness of gate oxide on silicon using first-principles method[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,1998(1/4):137-142.
[10] Neaton JB.;Ashcroft NW.;Muller DA. .Electronic properties of the Si/SiO2 interface from first principles[J].Physical review letters,2000(6):1298-1301.
[11] 黄安平 .反应溅射沉积高介电Ta<,2>O<,5>薄膜研究[D].北京工业大学,2004.
[12] Liao CC.;Tsai C.;Chin A. .Electrical characterization of Al2O3 on Si from thermally oxidized AlAs and Al[J].Journal of Crystal Growth,1999(0):652-655.
[13] 刘恩科;朱秉升;罗晋生.半导体物理学[M].北京:国防工业出版社,1994:84.
[14] 邢溯 .高介电常数材料的制备及电学性能研究[D].中国科学院上海微系统与信息技术研究所,2002.
[15] Hilton AD.;Ricketts BW. .DIELECTRIC PROPERTIES OF BA1-XSRXTIO3 CERAMICS[J].Journal of Physics, D. Applied Physics: A Europhysics Journal,1996(5):1321-1325.
[16] 相文峰;颜雷;谈国太.硅基集成电路的发展和新一代栅极氧化物材料的研究现状[A].北京:中国科学院物理研究所,2002
[17] Dalapati GK.;Chatterjee S.;Samanta SK.;Maiti CK. .Electrical characterization of low temperature deposited TiO2 films on strained-SiGe layers[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2003(3/4):249-254.
[18] Qi Wenjie;Nish R;Dharmarajan E et al.Ultrathin zirconium silicate thin film with good thermal stability for alternative gate dielectric application[J].Applied Physics Letters,2000,77(11):1704.
[19] H. Harris;K. Choi;N. Mehta;A. Chandolu;N. Biswas;G. Kipshidze;S. Nikishin;S. Gangopadhyay;H. Temkin .HfO_(2) gate dielectric with 0.5 nm equivalent oxide thickness[J].Applied physics letters,2002(6):1065-1067.
[20] E. P. Gusev;M. Copel;E. Cartier .High-resolution depth profiling in ultrathin Al_(2)O_(3) films on Si[J].Applied physics letters,2000(2):176-178.
[21] Chin A;Liao C C;Liu C H.Device and reliability of high-K Al2 O3 gate dielectric with good mobility and low Dit[M].Techn Dig VLSI Symp,1999:135.
[22] Kolodzey J.;Chowdhury E.A. .Electrical conduction and dielectric breakdown in aluminum oxide insulators on silicon[J].IEEE Transactions on Electron Devices,2000(1):121-128.
[23] Shao Q Y;Li A D;Ling H Q et al.Growth and characterization of Al2 O3 gate dielectric films by low-pressure metal organic chemical vapor deposition[J].Microelectronic Engineering,2003,66(1-4):842.
[24] Kwo J.;Kortan AR.;Queeney KL.;Chabal YJ.;Opila RL.;Muller DA.;Chu SNG.;Sapjeta BJ.;Lay TS.;Mannaerts JP.;Boone T.;Krautter HW. Krajewski JJ.;Sergnt AM.;Rosamilia JM.;Hong M. .Properties of high kappa gate dielectrics Gd2O3 and Y2O3 for Si[J].Journal of Applied Physics,2001(7):3920-3927.
[25] Wu Y H;Yang M Y;Chin A et al.Electrical characteristics of high quality La2 O3 gate dielectric with equivalent oxide thickness of 5 angstrom[J].IEEE Electron Device Letters,2000,21(07):341.
[26] Park D;King Y;Lu Qiang et al.Transistor characteristics with Ta2O5 gate dielectric[J].IEEE Electron Device Letters,1998,19(11):441.
[27] Isoke C;Saitoh M .Effect of ozone annealing on the dielectric properties of tantalum oxide thin films grown by chemical vapor deposition[J].Applied Physics Letters,1990,56:907.
[28] Kang C S;Cho H J;Choi R .Bonding states and electrical properties of ultrathin HfOxNy gate dielectrics[J].Applied Physics Letters,2002,81:2593.
[29] Houssa M;Degraeve R;Heyns M M .Electrical properties of thin SiON/Ta2O5 gate dielectric stacks[J].Journal of Applied Physics,1999,86:6462.
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