A New Model of Interfacial Physical Contact in Diffusion Bonding

材料科学技术（英文）, 2004, 20(1): 109-112.

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1.National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

2.National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

3.National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

基金项目: This work was supported by the Scientific Research Foundation of HIT(HIT.202.35) and Project 2003AA305210)

A New Model of Interfacial Physical Contact in Diffusion Bonding

Keywords： Diffusion bonding

Through eliminating voids not affecting the primary bonding process, and incorporating interlayer and flexible base material, the interface geometry character and brief mathematics process were put forth. Through analyzing contact process of diffusion bonding, contact area model was settled. It can interpret the phenomenon of different interface areas taking on different strengths. In the course of physical contact, shear stresses serve an important function for the plastic deformation and the cohesion of interface voids.

参考文献

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[5]	Peng HE .[J].Transactions of The China Welding Institution(in Chinese),1999,20:68.

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A New Model of Interfacial Physical Contact in Diffusion Bonding

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