分别用小通道角模具(模具Ⅰ)和大通道角模具(模具Ⅱ)以及A 路径和Bc路径对单晶铜和多晶铜进行等通道角挤压(ECAP)实验,对挤压后的组织进行光学显微镜(OM)和扫描电镜(SEM)观察,对挤压后的单晶铜组织进行XRD分析,研究单晶铜和多晶铜在挤压中的变形行为.结果表明:单晶铜在两种路径挤压后的抗拉强度无明显差异,用模具Ⅰ挤压时其力学性能的变化幅度较大,经多道次挤压后,其显微组织沿压力轴方向具有明显的定向排列特征.多晶铜在A路径挤压时,其抗拉强度的上升幅度明显比在Bc路径挤压时大.随着挤压道次的增加,两种材料的组织均匀化程度和硬度增大,其断裂方式逐渐由韧性断裂向脆性断裂方向转变.
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