近年来,窄带隙半导体材料因具有吸收太阳光可见波段能量、可见光催化降解有机物及可见光解水制氢的优异特性而成为新型半导体材料的研发热点.综述了以TiO2为代表的传统半导体材料掺杂体系以及全新组成材料体系等两大类具有窄带隙半导体特性的材料种类、光催化性能的影响因素、材料制备工艺以及应用前景,并在此基础上展望了研究与发展方向.
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