探讨了HEDP(羟基乙叉二膦酸)溶液体系滚镀铜工艺的可行性。通过正交试验和单因素实验研究了配位剂含量、主盐含量、电流、温度、装载量和施镀时间对滚镀铜的影响，得到最佳配方和工艺条件为：HEDP 120 g/L，CuSO4·5H2O 16 g/L，K2CO360 g/L， pH 9.5，温度50°C，阴极电流2.0 A，滚筒转速15 r/min，装载量50 g/筒。在该条件下滚镀1 h，可获得高、低电流密度区平均厚度分别为7.39μm和1.60μm，与钢铁基体结合良好的半光亮铜镀层。该滚镀铜工艺基本满足预镀铜的要求，但对有光亮度要求的产品，需要往镀液中加入适量添加剂HEAS。
The feasibility of copper barrel plating from HEDP (1-hydroxyethylidene-1,1-diphosphonic acid) bath was discussed. The optimal bath composition and process parameters were obtained by studying the effects of complexant content, main salt content, current, temperature, loading capacity, and plating time on copper barrel plating as follows:HEDP 120 g/L, CuSO4·5H2O 16 g/L, K2CO3 60 g/L, temperature 50 °C, pH 9.5, cathodic current 2.0 A, barrel rotation speed 15 r/min, and loading capacity 50 g per barrel. The copper coating prepared under the given conditions features an average thickness of 7.39 μm at high current density area while 1.60 μm at low current density area, a strong adhesion to steel substrate, and semi-bright appearance. The present copper barrel plating can basically meet the requirements of copper pre-plating. A suitable amount of additive HEAS should be added to bath for the products needing bright appearance.
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