随着电子信息行业的快速发展，超薄层状金属基复合丝材的需求不断增加。制备超薄层状金属基复合丝材的复合技术有4种，分别为：电镀技术、固相复合技术、复合铸造和气相沉积技术。通过复合质量和批量化生产条件两方面的比较，简要介绍了半导体封装用内引线-金银复合丝的复合工艺的选择和优化。
With the rapid development of electronic information industry, the demand of ultrathin layered metal matrix composite wires has being continuously increased. Four composite technologies of ultrathin layered metal matrix composite wires are introduced, that are electroplating technology, solid composite technology, composite casting and vapor deposition technology, respectively. The composite technology of gold-silver composite wire used for semiconductor packaging is chosen and optimized by comparison of composite quality and mass production condition.
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